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    HDI boards are generally manufactured using a lamination method. The more laminations, the higher the technical level of the board. Ordinary HDI boards are basically laminated one time. High-level HDI adopts two or more layered technologies. At the same time, advanced PCB technologies such as stacked holes, electroplated holes, and direct laser drilling are used. The following is about 8 Layer Robot HDI PCB related, I hope to help you better understand 8 Layer Robot HDI PCB.
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    XC5VLX110T-2FFG1136C

    XC5VLX110T-2FFG1136C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
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    N4000-13epsi PCB is a kind of high-frequency PCB produced by nelco in Singapore. Its main application field is aviation and communication industry. It has high temperature resistance, low temperature resistance, good water absorption and strong stability. It is FR4 high-frequency material and easy to process
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