XC7K70T-2FBG484I Manufacturers

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XC7K70T-2FBG484I, Adhering to the principle of "Enterprising and Truth-Seeking, Preciseness and Unity", with technology as the core, our company continues to innovate, dedicated to providing you with the highest cost-effective solutions and meticulous after-sales service. We firmly believe that: we're outstanding as we have been specialized.

Hot Products

  • BCM65551B1IFSBG

    BCM65551B1IFSBG

    BCM65551B1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPM2210F324C5N

    EPM2210F324C5N

    EPM2210F324C5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPF6016ATC144-3N

    EPF6016ATC144-3N

    EPF6016ATC144-3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Half-hole HDI PCB

    Half-hole HDI PCB

    Half-hole HDI PCB is a compact product designed for small capacity users. It adopts modular parallel design, with a module capacity of 1000VA (height of 1U), natural cooling, and can be directly put into a 19 "rack, with a maximum of 6 modules in parallel. The product adopts full digital signal processing (DSP) technology and a number of patent technologies. It has a full range of load adaptability and strong short-term overload capacity, and can not consider the load power factor and peak factor.
  • Alumina Ceramic PCB for auto lamp

    Alumina Ceramic PCB for auto lamp

    The alumina ceramic substrate series can effectively reduce the junction temperature of the headlight LED of the car, thereby greatly increasing the service life and luminous efficiency of the LED, and is especially suitable for use in a sealed environment with high stability requirements, a more demanding ambient temperature.The following is about Alumina Ceramic PCB for auto lamp, I hope to help you better understand Alumina Ceramic PCB for auto lamp.
  • BCM89830A0BWMLG

    BCM89830A0BWMLG

    BCM89830A0BWMLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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