XC7K325T-1FBG676C Manufacturers

"Sincerity, Innovation, Rigorousness, and Efficiency" is the persistent conception of our company for the long-term to develop together with customers for mutual reciprocity and mutual benefit for XC7K325T-1FBG676C, Adhering into the business enterprise philosophy of 'customer initial, forge ahead', we sincerely welcome purchasers from at your home and abroad to cooperate with us.
XC7K325T-1FBG676C, With good quality, reasonable price and sincere service, we enjoy a good reputation. Items are exported to South America, Australia, Southeast Asia and so on. Warmly welcome customers at home and abroad to cooperate with us for the brilliant future.

Hot Products

  • XCKU5P-L2FFVB676E

    XCKU5P-L2FFVB676E

    XCKU5P-L2FFVB676E is a high-performance FPGA (Field Programmable Gate Array) product launched by Xilinx. This FPGA belongs to the Kintex UltraScale+series and has the following features and specifications
  • XCZU27DR-2FSVE1156I

    XCZU27DR-2FSVE1156I

    XCZU27DR-2FSVE1156I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S2000-4FGG676C

    XC3S2000-4FGG676C

    XC3S2000-4FGG676C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Pressfit Hole PCB

    Pressfit Hole PCB

    For example, from the perspective of production process testing, IC testing is generally divided into chip testing, finished product testing, and inspection testing. Unless otherwise required, chip testing generally only conducts DC testing, and finished product testing can have either AC testing or DC testing. In more cases, both tests are available.The following is about Pressfit Hole PCB related, I hope to help you better understand Pressfit Hole PCB.
  • XCVU5P-2FLVA2104I

    XCVU5P-2FLVA2104I

    ​The XCVU5P-2FLVA2104I Virtex UltraScale+device is a high-performance FPGA based on 14nm/16nm FinFET nodes, supporting 3D IC technology and various computationally intensive applications.
  • AD8561AR

    AD8561AR

    AD8561AR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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