XC7K325T-1FBG676C Manufacturers

"Sincerity, Innovation, Rigorousness, and Efficiency" is the persistent conception of our company for the long-term to develop together with customers for mutual reciprocity and mutual benefit for XC7K325T-1FBG676C, Adhering into the business enterprise philosophy of 'customer initial, forge ahead', we sincerely welcome purchasers from at your home and abroad to cooperate with us.
XC7K325T-1FBG676C, With good quality, reasonable price and sincere service, we enjoy a good reputation. Items are exported to South America, Australia, Southeast Asia and so on. Warmly welcome customers at home and abroad to cooperate with us for the brilliant future.

Hot Products

  • HI-6138PQIF

    HI-6138PQIF

    HI-6138PQIF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU47DR-2FFVE1156I

    XCZU47DR-2FFVE1156I

    ​XCZU47DR-2FFVE1156I Embedded System on Chip (SoC) is a single-chip adaptive RF platform that can meet current and future industry needs. The Zynq UltraScale+RFSoC series can support all frequency bands below 6GHz, meeting the critical requirements of next-generation 5G deployment. At the same time, it can also support direct RF sampling for 14 bit analog-to-digital converters (ADCs) with a sampling rate of up to 5GS/S and 14 bit analog-to-digital converters (DACs) with a sampling rate of 10 GS/S, both of which have an analog bandwidth of up to 6GHz.
  • BCM82380BKFSBG

    BCM82380BKFSBG

    BCM82380BKFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CGXFC9E6F35C7N

    5CGXFC9E6F35C7N

    ​5CGXFC9E6F35C7N is an FPGA chip belonging to the Cyclone V GX series produced by Intel (formerly known as Altera). This chip has the following characteristics and parameters:
  • 25G Optical Module PCB

    25G Optical Module PCB

    Optical module products began to develop in two aspects. One is the hot-swappable optical module, which became the earliest hot-swap module GBIC. One is miniaturization, using an LC head, which is directly cured on the circuit board and becomes an SFF.The following is about 25G Optical Module PCB related, I hope to help you better understand 25G Optical Module PCB.
  • 8 Layer Robot HDI PCB

    8 Layer Robot HDI PCB

    HDI boards are generally manufactured using a lamination method. The more laminations, the higher the technical level of the board. Ordinary HDI boards are basically laminated one time. High-level HDI adopts two or more layered technologies. At the same time, advanced PCB technologies such as stacked holes, electroplated holes, and direct laser drilling are used. The following is about 8 Layer Robot HDI PCB related, I hope to help you better understand 8 Layer Robot HDI PCB.

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