XC7A50T-2FTG256C Manufacturers

We have state-of-the-art tools. Our products are exported towards the USA, the UK and so on, enjoying a fantastic reputation amongst customers for XC7A50T-2FTG256C, And there are quite a few international friends who came for sight seeing, or entrust us to buy other stuff for them. You might be most welcome to arrive to China, to our city also to our factory!
XC7A50T-2FTG256C, Our solutions have national accreditation standards for experienced, premium quality items, affordable value, was welcomed by people around the globe. Our goods will continue to increase in the order and look forward to cooperation with you, Really should any of those products be of interest to you, please letus know. We are going to be pleased to give you a quotation up on receipt of one's detailed specifications.

Hot Products

  • XC6VLX240T-2FFG1156I

    XC6VLX240T-2FFG1156I

    ​XC6VLX240T-2FFG1156I is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.
  • XC3S1400A-4FTG256I

    XC3S1400A-4FTG256I

    XC3S1400A-4FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP3C120F780I7N

    EP3C120F780I7N

    EP3C120F780I7N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • HI-1579PST

    HI-1579PST

    HI-1579PST is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Enterprise SSD Rigid-Flex PCB

    Enterprise SSD Rigid-Flex PCB

    The Enterprise SSD Rigid-Flex PCB can replace the composite printed circuit board formed by multiple connectors, multiple cables and ribbon cables, and has the advantages of stronger product performance, higher stability, lighter weight and smaller volume. The following is about Enterprise SSD Rigid Flex board related, I hope to help you better understand Enterprise SSD Rigid Flex board.
  • XCVU7P-2FLVA2104I

    XCVU7P-2FLVA2104I

    The XCVU7P-2FLVA2104I device provides the highest performance and integrated functionality on 14nm/16nm FinFET nodes. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements. It also provides a virtual single-chip design environment to provide registered routing lines between chips to achieve operation above 600MHz and provide richer and more flexible clocks.

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