XC7A35T-2CPG236C Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

BCM53134OKFBG
BCM53134OKFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XC6SLX100T-2CSG484C
XC6SLX100T-2CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
10AS022C4U19E3LG
10AS022C4U19E3LG is an electronic component, specifically belonging to Intel's package type 484-BFBGA batch 24+products. This component may be a programmable logic device, microprocessor, integrated circuit (IC), or other type of electronic component used in various electronic devices
XC6SLX4-2TQG144I
The XC6SLX4-2TQG144I device is optimized for applications that require absolute minimum cost. The Spartan-6 LX FPGA supports up to 150K logic density, 4.8Mb memory, integrated storage controllers, and easy-to-use high-performance system IPs (such as DSP modules), while adopting innovative open standard based configurations.
XCVU11P-1FLGB2104E
XCVU11P-1FLGB2104E is an FPGA (Field Programmable Gate Array) product produced by Xilinx, belonging to the Virtex UltraScale series. This FPGA has the following features and specifications:
XCVU13P-2FLGA2577E
XCVU13P-2FLGA2577E Virtex™ UltraScale+ ™ The device provides the highest performance and integrated functionality on the 14nm/16nm FinFET node. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements

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XC7A35T-2CPG236C Manufacturers

Related Products

Hot Products

BCM53134OKFBG

XC6SLX100T-2CSG484C

10AS022C4U19E3LG

XC6SLX4-2TQG144I

XCVU11P-1FLGB2104E

XCVU13P-2FLGA2577E

2017 Hongtai bids farewell to Shenzhen to settle in the Fourth Guangdong Association

PCB production, these matters you must pay attention to!

C919 Chinese people just made a shell? Let's see what the insiders say

Thermal stress treatment quality of heavy copper PCB

Introduction of chip

How to design the lamination when designing a 4-layer PCB circuit board

Nicole 2020-11-28 16:14:47

Andrea 2023-12-05 09:24:45

Kristin 2022-03-14 13:22:19

Sharon 2020-10-27 02:44:49

Bella 2023-02-05 11:05:49

Olive 2020-07-18 16:29:23

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.