XC7A15T-2FTG256I Manufacturers

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Hot Products

  • HI6110PQI

    HI6110PQI

    ​HI6110PQI is a versatile message processor for MIL-STD- 1553 applications. It can be configured as a Bus Controller, Remote Terminal or Bus Monitor, with or without assigned RT address.
  • XC5VSX50T-3FFG665C

    XC5VSX50T-3FFG665C

    XC5VSX50T-3FFG665C is an advanced field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 49,920 logic cells, 2.7 Mb of distributed RAM, and 400 Digital Signal Processing (DSP) slices, making it suitable for a wide range of high-performance applications. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The -3 speed grade of this FPGA allows it to operate up to 500 MHz. The device comes in a flip-chip fine-pitch ball grid array (FFG665C) package with 665 pins, providing high pin-count connectivity for a variety of applications. XC5VSX50T-3FFG665C is commonly used in industrial automation, aerospace and defense, telecom, and high-performance computing applications. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it an excellent choice for mission-critical and high-reliability applications.
  • Metal with mixture PCB

    Metal with mixture PCB

    Metal with mixture PCB The metal substrate is a metal circuit board material, which is a general electronic component. It is composed of a thermally conductive insulating layer, a metal plate and a metal foil. It has special magnetic permeability, excellent heat dissipation, high mechanical strength, and good processing performance. The following is about Biggs Aluminum PCB related, I hope to help you better understand Biggs Aluminum PCB.
  • 10M25DAF256C8G

    10M25DAF256C8G

    ​10M25DAF256C8G is a MAX 10 series FPGA chip produced by Intel (formerly Altera). The chip has 25000 logic elements, supports 178 I/O ports, and is packaged in FBGA-256.
  • EP2AGX190FF35I3G

    EP2AGX190FF35I3G

    EP2AGX190FF35I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 10M04SAU169C8G

    10M04SAU169C8G

    ​10M04SAU169C8G is a single-chip, non-volatile, low-cost programmable logic device (PLD) used for integrating the best set of system components.

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