XCVU13P-L2FLGA2577E is a powerful FPGA (Field-Programmable Gate Array) chip from Xilinx's Virtex UltraScale+ series. It features 13 million logic cells and 32 GB/s of memory bandwidth. This chip is built using 16nm process technology with FinFET+ technology, making it a high-performance chip with low power consumption.
XCVU13P-L2FLGA2577E is a powerful FPGA (Field-Programmable Gate Array) chip from Xilinx's Virtex UltraScale+ series. It features 13 million logic cells and 32 GB/s of memory bandwidth. This chip is built using 16nm process technology with FinFET+ technology, making it a high-performance chip with low power consumption.
The "L2FLGA2577E" in the name of XCVU13P-L2FLGA2577E refers to the batch and brand codes, while the "E" indicates the industrial-grade version of the chip. The chip is built to withstand harsh automotive and industrial environments, making it ideal for use in applications involving automobiles, aerospace, defense and automation.
This FPGA chip has a wide range of features, including multi-channel transceivers operating up to 32.75 Gb/s, Gigabit Ethernet, PCI Express Gen4, and other high-speed connectivity interfaces. It also has over 11 thousand DSP slices and can support numerous algorithmic accelerators. Its massive capacity and processing capabilities make this chip an excellent choice for high-performance computing, machine learning, and data center applications.
In addition, XCVU13P-L2FLGA2577E has a rich set of embedded components, including processors, memory, and other peripherals. It also provides support for software-defined infrastructures, cloud computing and applications, network and data center accelerators, along with other internet of things (IoT) applications.
Overall, the XCVU13P-L2FLGA2577E is a highly powerful and flexible FPGA chip with an efficient design that makes it perfect for handling high-computational intensive tasks.
