XC7A100T-1FGG676I Manufacturers

Our solutions are greatly recognized and reliable by customers and will fulfill continuously altering financial and social requirements for XC7A100T-1FGG676I, The continual availability of substantial grade products and solutions in combination with our fantastic pre- and after-sales services ensures strong competitiveness in an increasingly globalized current market.
XC7A100T-1FGG676I, Our company always concentrate on the development of the international market. We've got a lot of customers in Russia , European countries, the USA, the Middle East countries and Africa countries. We always follow that quality is foundation while service is guarantee to meet all customers.

Hot Products

  • 5M2210ZF256C5N

    5M2210ZF256C5N

    5M2210ZF256C5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU19EG-2FFVC1760I

    XCZU19EG-2FFVC1760I

    ​XCZU19EG-2FFVC1760I Zynq™ UltraScale+ ™ MPSoC (EG) devices not only provide scalability for 64 bit processors, but also combine real-time control with software and hardware engines, supporting graphics, video, waveform, and packet processing
  • 8MM Thick PCB

    8MM Thick PCB

    The aperture ratio of PCB is also called the ratio of thickness to diameter, which refers to the thickness of the board / aperture. If the aperture ratio exceeds the standard, the factory will not be able to process it. The limit of the aperture ratio cannot be generalized. For example, via holes, laser blind holes, buried holes, solder mask plug holes, resin plug holes, etc. are different. The aperture ratio of the via hole is 12: 1, which is a good value. The industry limit is currently 30: 1. The following is about 8MM Thick PCB related, I hope to help you better understand 8MM Thick PCB.
  • EP3C80F780I7N

    EP3C80F780I7N

    EP3C80F780I7N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCKU11P-2FFVE1517I

    XCKU11P-2FFVE1517I

    XCKU11P-2FFVE1517I The XCKU11P-2FFFVE1517I field programmable array has multiple power options to achieve the best balance between required system performance and extremely low power consumption. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system
  • 2Step HDI PCB

    2Step HDI PCB

    According to the use of high-end HDI board-3G board or IC carrier board, its future growth is very rapid: the world's 3G mobile phone growth will exceed 30% in the next few years, China will soon issue 3G licenses; IC carrier board industry consulting agency Prismark predicts China's forecasted growth rate from 2005 to 2010 is 80%, which represents the development direction of PCB technology. The following is about 2Step HDI PCB related, I hope to help you better understand 2Step HDI PCB.

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