XC6VLX550T-1FFG1760C Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XCVU125-2FLVB1760E

    XCVU125-2FLVB1760E

    XCVU125-2FLVB1760E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S250E-4PQG208I

    XC3S250E-4PQG208I

    XC3S250E-4PQG208I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10M02SCU169I7G

    10M02SCU169I7G

    ​10M02SCU169I7G is a MAX 10 series FPGA chip produced by Intel (formerly Altera). This chip belongs to the field programmable gate array (FPGA) and has non-volatile characteristics. It provides 130 I/O ports and is packaged in UBGA-169. It supports a working voltage of 3.3V, a working temperature range of -40 ° C to+100 ° C, and a maximum working frequency of 450MHz.
  • XCKU15P-1FFVA1156E

    XCKU15P-1FFVA1156E

    XCKU15P-1FFVA1156E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2VP70-6FFG1517C

    XC2VP70-6FFG1517C

    XC2VP70-6FFG1517C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM56445B0IFSBLG

    BCM56445B0IFSBLG

    BCM56445B0IFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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