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XC6SLX75-2CSG484I Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    XCZU2CG-1SFVC784I

    XCZU2CG-1SFVC784I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Halogen-free PCB

    Halogen-free PCB

    Halogen-free PCB -- halogen (halogen) is a group VII a non-gold Duzhi element in Bai, including five elements: fluorine, chlorine, bromine, iodine and astatine. Astatine is a radioactive element, and the halogen is usually referred to as fluorine, chlorine, bromine and iodine. Halogen-free PCB is environmental protection PCB does not contain the above elements.
  • EP2S60F1020C5N

    EP2S60F1020C5N

    EP2S60F1020C5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 10AX115H3F34I2SG

    10AX115H3F34I2SG

    ​10AX115H3F34I2SG adopts a 20 nanometer process, which can provide high performance, supporting chip to chip data transmission rates of up to 17.4 Gbps, backplane data transmission rates of up to 12.5 Gbps, and up to 1.15 million equivalent logic units.
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    10CL120YF780I7G

    ​10CL120YF780I7G Programmable Logic Device (CPLD/FPGA) Intel/LTERA/Altra BGA 23+/24+
  • 12OZ Heavy copper PCB

    12OZ Heavy copper PCB

    12OZ Heavy copper PCB is a layer of copper foil bonded on the glass epoxy substrate of printed circuit board. When the copper thickness is ≥ 2oz, it is defined as Heavy copper PCB. Performance of Heavy copper PCB: 12OZ Heavy copper PCB has the best elongation performance, which is not limited by processing temperature. Oxygen blowing can be used at high melting point, and brittle at low temperature. It is also fireproof and belongs to non combustible material. Even in highly corrosive atmospheric environment, copper board will form a strong, non-toxic passivation protection layer.
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