XC6SLX75-2CSG484I Manufacturers

"Control the quality by the details, show the strength by quality". Our company has strived to establish a highly efficient and stable staff team and explored an effective quality control process for XC6SLX75-2CSG484I, We sincerely welcome buddies to negotiate business enterprise and start cooperation with us. We hope to join hands with good friends in different industries to produce a brilliant long term.
XC6SLX75-2CSG484I, As an experienced group we also accept customized order and make it same as your picture or sample specifying specification and customer design packing. The main goal of our company is to build up a satisfactory memory to all customers, and establish a long term win-win business relationship. Choose us, we always wait for your appearance!

Hot Products

  • BCM56867A1IFSBG

    BCM56867A1IFSBG

    BCM56867A1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • H800-865K-A1

    H800-865K-A1

    H800-865K-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 24 Layers ELIC HDI PCB

    24 Layers ELIC HDI PCB

    24 Layers ELIC HDI PCB--When a printed circuit board is made into a final product, integrated circuits, transistors (triodes, diodes), passive components (such as resistors, capacitors, connectors, etc.) and various other electronic parts are mounted on it. The following is about 24 Layers of Any Connected HDI related, I hope to help you better understand 24 Layers of Any Connected HDI.
  • XC6SLX9-2CSG324C

    XC6SLX9-2CSG324C

    XC6SLX9-2CSG324C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10M25DAF484C8G

    10M25DAF484C8G

    ​10M25DAF484C8G is an FPGA (Field Programmable Gate Array) product produced by Altera (now acquired by Intel). This FPGA adopts FBGA484 package and has the following key features: Packaging form: FBGA484 packaging is used, which is a surface mount technology suitable for high-density integrated circuits. Working temperature range: The minimum working temperature is -40 ° C, and the maximum working temperature is 130 ° C, suitable for applications under various environmental conditions.
  • XCVU9P-L2FLGB2104E

    XCVU9P-L2FLGB2104E

    ​XCVU9P-L2FLGB2104E is a high-performance FPGA chip in Xilinx's Virtex UltraScale+series. The chip adopts advanced 28 nanometer high-K metal gate (HKMG) technology, combined with stacked silicon interconnect (SSI) technology, to achieve a perfect combination of low power consumption and high performance

Send Inquiry