XC6SLX45T-3CSG484C Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • ultra-thin BT PCB

    ultra-thin BT PCB

    ultra-thin BT PCB--Solid State Drive (Solid State Disk or Solid State Drive, referred to as SSD), commonly known as solid state drive, solid state drive is a hard disk made of solid state electronic storage chip array, because the solid state capacitor in Taiwan English is called Solid.The following is about Ultra Thin SSD Card PCB related, I hope to help you better understand Ultra Thin SSD Card PCB.
  • Double sided RO4350B PCB

    Double sided RO4350B PCB

    The high-frequency control board is mainly composed of a high-frequency induction heating main control board and two drives. The high-frequency board technology uses SG3525A as a PWM pulse. The output pulse frequency range is 20KHZ-60KHZ, the pulse interval is 180 degrees, and the dead time You can adjust it yourself. The following is about Double sided RO4350B PCB related, I hope to help you better understand Double sided RO4350B PCB.
  • 5CSEMA5U23C6N

    5CSEMA5U23C6N

    5CSEMA5U23C6N is an FPGA (Field Programmable Gate Array) chip produced by Altera (now acquired by Intel)
  • BCM53724B0KPB

    BCM53724B0KPB

    BCM53724B0KPB is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S200-4PQG208C

    XC3S200-4PQG208C

    XC3S200-4PQG208C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU13P-L2FLGA2577E

    XCVU13P-L2FLGA2577E

    XCVU13P-L2FLGA2577E is a powerful FPGA (Field-Programmable Gate Array) chip from Xilinx's Virtex UltraScale+ series. It features 13 million logic cells and 32 GB/s of memory bandwidth. This chip is built using 16nm process technology with FinFET+ technology, making it a high-performance chip with low power consumption.

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