Products
Home > Products > XC6SLX4-2CSG225I

XC6SLX4-2CSG225I Manufacturers

Our goal is to satisfy our customers by offering golden service, good price and high quality for XC6SLX4-2CSG225I, Our products are strictly inspected before exporting , So we gain a good reputation all over the world. We looking forward to cooperation with you in the future.
XC6SLX4-2CSG225I, Our Company policy is "quality first, to be better and stronger, sustainable development" . Our pursuit goals is "for society, customers, employees, partners and enterprises to seek reasonable benefit". We aspirate to do cooperate with all different the auto parts manufacturers, repair shop, auto peer , then create a beautiful future! Thank you for taking time to browse our website and we would welcome any suggestions you may have that can help us to improve our site.

Related Products

Hot Products

  • Heavy copper PCB

    Heavy copper PCB

    Printed circuit boards are usually bonded with a layer of copper foil on glass epoxy substrate. The thickness of copper foil is usually 18 μ m, 35 μ m, 55 μ m and 70 μ M. The most commonly used copper foil thickness is 35 μ M. When the weight of copper is more than 70UM, it is called heavy copper PCB
  • Ladder PCB

    Ladder PCB

    Ladder PCB technology can reduce the thickness of PCB locally, so that the assembled devices can be embedded in the thinning area, and realize the bottom welding of ladder, so as to achieve the purpose of overall thinning.
  • Printed circuit board

    Printed circuit board

    The names of circuit board are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, heavy copper board, impedance board, PCB, ultra-thin circuit board,printed circuit board, etc.
  • 10AX066H3F34I2LG

    10AX066H3F34I2LG

    10AX066H3F34I2LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7S15-2CPGA196I

    XC7S15-2CPGA196I

    ​XC7S15-2CPGA196I Spartan ® -7 Field Programmable Gate Array adopts 28 nanometer technology and is equipped with MicroBlaze ™ Soft processor, running over 200 DMIPs, supporting 800Mb/s DDR3
  • XC6SLX100-3FGG676I

    XC6SLX100-3FGG676I

    XC6SLX100-3FGG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • How to solve the problem of high-end PCB proofing

    As we all know, the competition in China's PCB manufacturing industry is very fierce. A complete industrial chain has been formed from a series of processes such as PCB proofing, mass production, packaging and transportation. In recent years, through extensive and rapid development and cruel market competition, the basic pattern of China's PCB industry has been formed. Relevant data show that by 2020, the number of PCB enterprises in Chinese Mainland alone will reach more than 2000, an amazing number.

  • electronic component. pcb

    Printed circuit board (PCB), also known as printed circuit board, is the supplier of electrical connection of electronic components. Its development has a history of more than 100 years. Its design is mainly layout design. The main advantage of using circuit board is that it greatly reduces the wiring and assembly errors, and improves the automation level and production labor rate. According to the number of circuit board layers, it can be divided into single board, double board, four board, six board and other multilayer circuit boards.

  • Main Classification of Chips

    According to functional classification, it can be divided into four types, mainly memory chips, microprocessors, standard chips, and complex systems on chip (SoCs). According to the types of integrated circuits, they can be divided into three categories: digital chips, analog chips, and hybrid chips.

  • Main manufacturing technology of Multilayer PCB printed circuit board

    In 1936, Austrian Paul Eisler first used printed circuit board in radio. In 1943, Americans mostly applied this technology to military radios. In 1948, the United States officially recognized that this invention can be used for commercial purposes. Since the mid-1950s, printed circuit boards have been widely used.

  • Detailed explanation of Multilayer PCB laminated structure

    Before designing multi-layer PCB circuit board, the designer needs to first determine the circuit board structure according to the scale of the circuit, the size of the circuit board and the requirements of electromagnetic compatibility (EMC),

  • The origin of 50 ohms in impedance matching

    For traces with a certain width, three main factors will affect the impedance of PCB traces. First of all, the EMI (electromagnetic interference) of the near field of the PCB trace is proportional to the height of the trace from the reference plane. The lower the height, the smaller the radiation. Secondly, the crosstalk will change significantly with the height of the trace. If the height is reduced by half, the crosstalk will be reduced to nearly a quarter.

Send Inquiry