XC6VLX365T-2FFG1759I Packaging BGA integrated circuit chips, IC electronic components, inquiry and order. Our company has professional supply chain services at multiple levels, including forecasting, contracts, stocking, in transit, inventory, and credit, to help customers shorten product procurement cycles, reduce inventory, lower costs, and improve market response speed,
XC6VLX365T-2FFG1759I Packaging BGA integrated circuit chips, IC electronic components, inquiry and order. Our company has professional supply chain services at multiple levels, including forecasting, contracts, stocking, in transit, inventory, and credit, to help customers shorten product procurement cycles, reduce inventory, lower costs, and improve market response speed,
Number of logic components
364032 LE
Adaptive Logic Module - ALM
56880 ALM
Embedded memory
14.63 Mbit
Number of input/output terminals
720 I/O
Working power supply voltage
1 V
Minimum operating temperature
-40 C
Maximum operating temperature
+100 C
Installation style
SMD/SMT
Packaging/Box
FCBGA-1759
Data rate
6.6 Gb/s
