Products
Home > Products > XC6SLX100T-2FGG676C

XC6SLX100T-2FGG676C Manufacturers

Our intention would be to provide top quality products and solutions at competitive charges, and top-notch support to customers around the world. We have been ISO9001, CE, and GS certified and strictly adhere to their quality specifications for XC6SLX100T-2FGG676C, Our organization has been devoting that "customer first" and committed to helping clients expand their small business, so that they become the Big Boss !
XC6SLX100T-2FGG676C, Adhering to the principle of "Enterprising and Truth-Seeking, Preciseness and Unity", with technology as the core, our company continues to innovate, dedicated to providing you with the highest cost-effective solutions and meticulous after-sales service. We firmly believe that: we're outstanding as we have been specialized.

Related Products

Hot Products

  • EP4SGX530KH40I4

    EP4SGX530KH40I4

    ​EP4SGX530KH40I4G - Stratix IV GX High Density and High Performance Field Programmable Gate Array
  • 5CGTFD9E5F35C7N

    5CGTFD9E5F35C7N

    ​5CGTFD9E5F35C7N is an FPGA (Field Programmable Gate Array) chip belonging to the Cyclone V GT series of the Altera brand. This chip is packaged in 1152-BGA and is suitable for various complex digital signal processing and communication applications. The main features of the 5CGTFD9E5F35C7N chip include high-performance processing capability, low-power design, rich I/O interfaces, and programmability. Specifically:
  • XCZU7EG-2FBVB900I

    XCZU7EG-2FBVB900I

    XCZU7EG-2FBVB900I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU6EG-2FFVB1156I

    XCZU6EG-2FFVB1156I

    XCZU6EG-2FFVB1156I based on Xilinx ® UltraScale MPSoC architecture. This product integrates feature rich 64 bit quad core or dual core Arm ® Cortex-A53 and dual core Arm Cortex-R5F processing system (based on Xilinx) ® UltraScale MPSoC architecture).
  • 22Layer RF PCB

    22Layer RF PCB

    22Layer RF PCB a radiofrequenza HONTEC lavora a stretto contatto con il team di progettazione del prodotto per garantire che gli obiettivi di costo/prestazioni del progetto siano raggiunti fornendo informazioni sulle opzioni dei materiali, sui costi relativi e sui problemi DFM. Nella foto, 22L RF - Materiale per radiofrequenza; THK: 2,45 mm; finitura superficiale: ENIG; controllo dell'impedenza.
  • XCVU5P-2FLVB2104E

    XCVU5P-2FLVB2104E

    ​The XCVU5P-2FLVB2104E Virtex UltraScale+device is a high-performance FPGA based on 14nm/16nm FinFET nodes, supporting 3D IC technology and various computationally intensive applications.
  • Related Blog
  • Reviews

  • What is semiconductor

    Substances and materials in nature can be divided into three categories: conductors, semiconductors and insulators according to their conductivity. The resistivity of semiconductor is in the range of 1m Ω· cm ~ 1g Ω· cm (the upper limit is taken according to Xie jiakui's electronic circuit, and 1/10 or 10 times of it; because the angle mark is not available, the current description is used temporarily)

  • Composition and main functions of PCB

    PCB is mainly composed of pad, through hole, mounting hole, wire, component, connector, filling

  • PCB Engineer have to know the basic knowledge of PCB-Hongtai pcb of Technology Sharing

    The following five aspects are introduced to you: 1. Brief introduction of circuit board 2. Introduction of circuit board base materil 3. Basic stack structure of circuit board 4. Circuit board production process

  • Installation mode of components on PCB printed circuit board

    Our common computer boards and cards are basically epoxy resin glass cloth based double-sided printed circuit boards. One side is the plug-in components, and the other side is the welding surface of the component feet. It can be seen that the welding points are very regular

  • DHI board surface treatment technology carbon series direct plating

    This article will review the development history of carbon series direct plating technology, including new breakthroughs in equipment technology, and how to apply it to today's flagship mobile phones with extremely fine line width and line spacing.

  • PCB production, you must pay attention to these matters

    Cutting, fillet, edging, baking, inner layer pretreatment, coating, exposure, DES (development, etching, film removal), punching, AOI inspection, VRS repair, browning, lamination, pressing, target drilling, Gong edge, drilling, copper plating, film pressing, printing, writing, surface treatment, final inspection, packaging and other processes are countless

Send Inquiry