Products
Home > Products > XC6SLX100-3FGG900C

XC6SLX100-3FGG900C Manufacturers

We are going to dedicate ourselves to providing our esteemed buyers together with the most enthusiastically thoughtful products and services for XC6SLX100-3FGG900C, We now have substantial goods source and also the rate is our advantage. Welcome to inquire about our merchandise.
XC6SLX100-3FGG900C, Being guided by customer demands, aiming at improving the efficiency and quality of customer service, we constantly improve products and provide more comprehensive services. We sincerely welcome friends to negotiate business and start cooperation with us. We hope to join hands with friends in different industries to create a brilliant future.

Related Products

Hot Products

  • XCKU115-2FLVF1924I

    XCKU115-2FLVF1924I

    XCKU115-2FLVF1924I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX16-2CSG324C

    XC6SLX16-2CSG324C

    XC6SLX16-2CSG324C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10M16SAU169C8G

    10M16SAU169C8G

    10M16SAU169C8G is a high-performance FPGA chip produced by Intel (formerly Altera). This chip is manufactured using a 10nm process and has 1696 logic units and 1 million lookup tables. It has low power consumption and is suitable for applications that require high power consumption
  • EP2AGX95EF29C6G

    EP2AGX95EF29C6G

    EP2AGX95EF29C6G is a product code of Intel Programmable Solutions Group, which belongs to overseas purchasing. It complies with RoHS standards, which means it is lead-free and meets environmental requirements. Although specific data manuals and parameter information are not provided
  • XCKU3P-2SFVB784I

    XCKU3P-2SFVB784I

    XCKU3P-2SFVB784I is a Field-Programmable Gate Array (FPGA) chip from Xilinx's Kintex UltraScale+ family, which is a high-performance FPGA designed with advanced features and capabilities. The chip features 2.6 million logic cells, 2604 DSP slices, and 47 Mb UltraRAM, and is built using a 20nm process technology
  • 5M570ZF256C5N

    5M570ZF256C5N

    5M570ZF256C5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • Main manufacturing technology of Multilayer PCB printed circuit board

    In 1936, Austrian Paul Eisler first used printed circuit board in radio. In 1943, Americans mostly applied this technology to military radios. In 1948, the United States officially recognized that this invention can be used for commercial purposes. Since the mid-1950s, printed circuit boards have been widely used.

  • What is a chip

    Definition: An integrated circuit chip is a small, thin silicon-based material that integrates electronic components such as transistors, resistors, capacitors, etc. It is a fundamental component of electronic devices.

  • What are the functions of semiconductors

    Semiconductors refer to materials with conductivity between conductors and insulators at room temperature. Semiconductor is a kind of material with controllable conductivity, ranging from insulator to conductor

  • What are electronic components

    Electronic components are components of electronic components and small machines and instruments. They are often composed of several parts and can be used in similar products; It often refers to some parts of electrical appliances, radios, meters and other industries, and is the general

  • High Frequency PCB processing attention points

    High Frequency PCB processing attention points.

  • Difference between missing printing covering layer and laminated covering film of FPC circuit board

    After the covering film of FPC circuit board is positioned, it is necessary to heat and pressurize to make the adhesive completely solidified and integrated with the circuit.

Send Inquiry