XC6SLX100-2FGG484C Manufacturers

While in the past few years, our organization absorbed and digested sophisticated technologies both equally at home and abroad. Meanwhile, our corporation staffs a group of experts devoted to your advancement of XC6SLX100-2FGG484C, As an expert specialized with this field, we have been committed to solving any problem of significant temperature protection for users.
XC6SLX100-2FGG484C, Our company is an international supplier on this kind of merchandise. We present an amazing selection of high-quality products. Our goal is to delight you with our distinctive collection of mindful solutions while providing value and excellent service. Our mission is simple: To offer the best solutions and service to our customers at the lowest prices possible.

Hot Products

  • RO3003 PCB

    RO3003 PCB

    The delay per unit inch on the PCB is 0.167ns. However, if there are more vias, more device pins, and more constraints set on the network cable, the delay will increase. Generally, the signal rise time of high-speed logic devices is about 0.2ns. If there are GaAs chips on the board, the maximum wiring length is 7.62mm. The following is about RO3003 PCB related, I hope to help you better understand RO3003 PCB.
  • XC7S75-1FGGA676C

    XC7S75-1FGGA676C

    ​XC7S75-1FGGA676C is an FPGA (Field Programmable Gate Array) product produced by Xilinx, belonging to the Spartan-7 series. This FPGA has the following features and specifications:
  • XC3S2000-4FGG676C

    XC3S2000-4FGG676C

    XC3S2000-4FGG676C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • GA100-874AA-A1

    GA100-874AA-A1

    GA100-874AA-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM56160B0IFSBG

    BCM56160B0IFSBG

    BCM56160B0IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K410T-1FBG676C

    XC7K410T-1FBG676C

    XC7K410T-1FBG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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