XC5VLX20T-1FF323C Manufacturers

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XC5VLX20T-1FF323C, Our merchandise have enjoyed a great reputation for their good quality, competitive prices and prompt shipment in international market. Presently, we are sincerely looking forward to cooperating with more overseas customers based on mutual benefits.

Hot Products

  • 5AGTMD3G3F31I3G

    5AGTMD3G3F31I3G

    5AGTMD3G3F31I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCZU21DR-2FFVD1156I

    XCZU21DR-2FFVD1156I

    Overview of XCZU21DR-2FFVD1156I RF Data Converter Subsystem Most Zynq UltraScale+RFSoCs include an RF data converter subsystem that includes multiple radios Frequency analog-to-digital converter (RF-ADC) and multiple RF analog-to-digital converters Converter (RF-DAC). High precision, high-speed, and energy-efficient RF-ADC and RF-DAC Can be configured separately for real data, or in most cases can be configured in pairs for real and imaginary numbers
  • XC3S200A-4FTG256I

    XC3S200A-4FTG256I

    XC3S200A-4FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 18-Layer Rigid-Flex PCB

    18-Layer Rigid-Flex PCB

    18-Layer Rigid-Flex PCB refers to a printed circuit board containing one or more rigid areas and one or more flexible areas, which is composed of rigid boards and flexible boards orderly laminated together, and is electrically connected with metallized holes. Rigid Flex PCB not only can provide the support function that rigid pcb should have, but also has the bending property of flexible board, which can meet the requirements of 3D assembly.
  • XC3S500E-4FGG320C

    XC3S500E-4FGG320C

    XC3S500E-4FGG320C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EP3C80U484I7N

    EP3C80U484I7N

    EP3C80U484I7N is a field programmable gate array (FPGA) chip designed by Altera. It has 484 I/O pins and supports multiple input/output interfaces such as LVDS, LVCMOS, LVTTL, etc. In addition, EP3C80F484I7N also has strong logical processing capabilities, which can implement various complex digital signal processing algorithms

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