Products
Home > Products > XC4VFX100-11FFG1517I

XC4VFX100-11FFG1517I Manufacturers

We now have a skilled, performance team to supply good quality services for our consumer. We often follow the tenet of customer-oriented, details-focused for XC4VFX100-11FFG1517I, Our solutions are widely recognized and reliable by users and can satisfy continuously acquiring economic and social needs.
XC4VFX100-11FFG1517I, With the spirit of "credit first, development through innovation, sincere cooperation and joint growth", our company is striving to create a brilliant future with you, so as to become a most valuable platform for exporting our products in China!

Related Products

Hot Products

  • Robot 3step HDI PCB

    Robot 3step HDI PCB

    The heat resistance of the Robot 3step HDI PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.
  • BCM43694B1KRFBG

    BCM43694B1KRFBG

    BCM43694B1KRFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • LT1764AEFE#PBF

    LT1764AEFE#PBF

    LT1764AEFE#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU37P-3FSVH2892E

    XCVU37P-3FSVH2892E

    XCVU37P-3FSVH2892E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCZU4EG-2FBVB900I

    XCZU4EG-2FBVB900I

    ​XCZU4EG-2FBVB900I is an FPGA programmable logic device chip launched by Xilinx. This chip belongs to the Virtex-6 series and has the characteristics of high performance and high integration, suitable for various complex application scenarios
  • XCKU115-2FLVB1760E

    XCKU115-2FLVB1760E

    XCKU115-2FLVB1760E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • What is a PCB back drill?

    Therefore, PCB manufacturers will leave a small point. The length of the left STUB is called B value, which is generally in the range of 50-150UM.

  • What is a chip

    Definition: An integrated circuit chip is a small, thin silicon-based material that integrates electronic components such as transistors, resistors, capacitors, etc. It is a fundamental component of electronic devices.

  • When designing a four-layer PCB circuit board, how is the stack-up generally designed?

    When designing a four-layer PCB circuit board, how is the stack-up generally designed?

  • What material is the chip mainly composed of

    Chip is the general term of semiconductor component products. Chip is also called integrated circuit and IC. What material is the chip mainly composed of? Let's have a look!

  • The characteristics of rigid-flex board

    Rigid-flex board is a combination of flexible board and hard board. It is a circuit board formed by combining a thin layered flexible bottom layer with a rigid bottom layer, and then laminating it into a single component.The flexible board is used to replace the cable assembly to complete the highly reliable connection and transmission of power and electrical signals.The product can work stably and reliably for a long time under harsh environments such as high and low temperature, high humidity, vibration, salt spray, and low air pressure. At present, Jonhon Optronic has provided rigid and flexible printed board solutions for aviation, aerospace, ships, weapons and other fields.

  • What does a chip mean

    A chip refers to a silicon chip containing integrated circuits, which is small in size and is a part of a mobile phone, computer, or other electronic device. If the most important organ of the human body is the brain, then chips are the "brain" of electronic devices. A chip is an integrated circuit, also known as a microelectronic chip, composed of many electronic devices, circuit components, organic matter, etc., packaged on a single silicon chip, and is one of the foundations of modern electronic technology. Because of its small size, low power consumption, high manufacturing difficulty, and high reliability

Send Inquiry