XC3SD1800A-4FGG676C Manufacturers

"Sincerity, Innovation, Rigorousness, and Efficiency" is the persistent conception of our firm for that long-term to acquire with each other with buyers for mutual reciprocity and mutual reward for XC3SD1800A-4FGG676C, We've been usually looking ahead to forming profitable company interactions with new clientele within the earth.
XC3SD1800A-4FGG676C, We strongly believe that technology and service is our base today and quality will create our reliable walls of future. Only we have better and better quality , could we achieve our customers and ourselves, too. Welcome customers all over the word to contact us for getting further business and reliable relationships. We are always here working for your demands whenever you need.

Hot Products

  • XCVU13P-3FLGA2577E

    XCVU13P-3FLGA2577E

    XCVU13P-3FLGA2577E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7S50-1FGGA484C

    XC7S50-1FGGA484C

    XC7S50-1FGGA484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX415T-2FFG1158C

    XC7VX415T-2FFG1158C

    XC7VX415T-2FFG1158C is a type of FPGA (Field Programmable Gate Array) made by Xilinx. This specific FPGA has 1.34 million logic cells, operates at a speed of up to 800 MHz, and features 16 Transceivers,
  • copper paste filled hole PCB

    copper paste filled hole PCB

    copper paste filled hole PCB: Bai AE3030 copper pulp is a non-conductive DAO copper paste used for the high-density assembly of printed substrate DU plate and the laying of wires.Due to the characteristics of Zhuan "high Thermal conductivity", "bubble-free", "flat" and so on, the copper paste is most suitable for the design of high reliability Pad on Via, stack on Via and Thermal Via. The copper paste is widely used from aerospace satellite, server, cabling machine, LED backlight and so on.
  • XC7VX690T-2FFG1926I

    XC7VX690T-2FFG1926I

    XC7VX690T-2FFG1926I Field Programmable Gate Array (FPGA) is a device that utilizes stacked silicon interconnect (SSI) technology and can meet the system requirements of various applications. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system. Virtex-7 is suitable for applications such as 10G to 100G networks, portable radar, and ASIC prototype design.
  • XC7K325T-2FFG900I

    XC7K325T-2FFG900I

    ​XC7K325T-2FFG900I is used to connect to the host system. The 7 series devices utilize Xilinx's unified architecture to protect IP investments and can easily migrate 6 series designs. The unified architecture has universal components, including logic structure, Block RAM, DSP, clock, analog mixed signal (AMS), and fast target changing within the 7 series. The Kindex-7 FPGA architecture greatly shortens development time, allowing designers to focus on product differentiation and new projects for migration.

Send Inquiry