XC3S400-4PQG208I Manufacturers

XCVU095-2FFVB2104I is an advanced programmable logic device launched by a well-known semiconductor company, especially based on Xilinx's UltraScale+architecture 1. Here is a detailed introduction to the chip:

XCVU29P-3FSGA2577E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

ENEPIG PCB is the abbreviation of gold plating, palladium plating and nickel plating. ENEPIG PCB coating is the latest technology used in electronic circuit industry and semiconductor industry. The gold coating with thickness of 10 nm and palladium coating with thickness of 50 nm can achieve good conductivity, corrosion resistance and friction resistance.

XCZU17EG-1FFVB1517E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

XCVU9P-L2FLGA2577E is a Virtex UltraScale+ FPGA chip from Xilinx. It features 924,480 logic cells and 3600 DSP units, and utilizes 16nm FinFET+ process technology.

The 12-layer AP9222R Rigid-Flex PCB of flexible circuit board and Rigid circuit board is a kind of circuit board with FPC characteristics and PCB characteristics, which is formed by Rigid - Flex PCB together according to relevant process requirements through pressing and other processes.