XC3S200AN-4FT256C Manufacturers

With our superb management, potent technical capability and strict quality command procedure, we go on to provide our shoppers with trustworthy high-quality, reasonable costs and outstanding services. We goal at becoming considered one of your most trustworthy partners and earning your pleasure for XC3S200AN-4FT256C, We invites both you and your enterprise to thrive along with us and share a vibrant long term in global sector.
XC3S200AN-4FT256C, We strive for excellence, constant improvement and innovation, is committed to make us the "customer trust" and the "first choice of engineering machinery accessories brand" suppliers. Choose us, sharing a win-win situation!

Hot Products

  • XCKU3P-L1SFVB784I

    XCKU3P-L1SFVB784I

    XCKU3P-L1SFVB784I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • DuPont material FPC

    DuPont material FPC

    DuPont material FPC cable board is small in size and light in weight. DuPont material FPC cable board original design of the cable board was used to replace the larger wire harness wire. In the current cutting-edge electronic device assembly board,DuPont material FPC cable board is usually the only solution to meet the requirements of miniaturization and movement.
  • 5SGXMA3H2F35C2G

    5SGXMA3H2F35C2G

    ​5SGXMA3H2F35C2G is an FPGA (Field Programmable Gate Array) chip produced by Intel/Altera. This chip has a specific packaging form, namely FBGA-1152 (35x35), which means it has 1152 pins arranged in a 35x35 matrix.
  • BCM5221A4KMLG

    BCM5221A4KMLG

    BCM5221A4KMLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU060-2FFVA1517E

    XCKU060-2FFVA1517E

    ​XCKU060-2FFVA1517E has been optimized for system performance and integration in a 20nm process, and adopts single-chip and next-generation stacked silicon interconnect (SSI) technology. This FPGA is also an ideal choice for DSP intensive processing required for next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure.
  • XCVU13P-2FHGA2104I

    XCVU13P-2FHGA2104I

    XCVU13P-2FHGA2104I is a scalable and reconfigurable acceleration platform suitable for optimizing complex workloads. It has a large amount of raw computing power and I/O flexibility, suitable for computationally intensive workloads in data center applications

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