XC3S200AN-4FT256C Manufacturers

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Hot Products

  • IC Carrier Board

    IC Carrier Board

    The IC carrier board is mainly used to carry the IC, and there are lines inside to conduct the signal between the chip and the circuit board. In addition to the function of the carrier, the IC carrier board also has a protection circuit, a dedicated line, a heat dissipation path, and a component module. Standardization and other additional functions.
  • 10AX027H3F35E2SG

    10AX027H3F35E2SG

    10AX027H3F35E2SG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Mixed HDI PCB of RO4003C

    Mixed HDI PCB of RO4003C

    High-frequency substrates, satellite systems, mobile phone receiving base stations and other communication products must use high-frequency circuit boards, which will inevitably develop rapidly in the next few years, and high-frequency substrates will be in large demand. The following is about Mixed HDI PCB of RO4003C related, I hope to help you better understand Mixed HDI PCB of RO4003C.
  • BCM63138SEKFSBG

    BCM63138SEKFSBG

    The BCM63138SEKFSBG is a high-performance multimedia gateway SoC (System-on-Chip) from Broadcom, a leading global semiconductor company specializing in wired and wireless communications technologies. This SoC is designed to meet the growing demands of multi-service and multimedia home gateway applications, providing a robust and scalable solution for telecom service providers.
  • XC3S1400AN-4FGG676C

    XC3S1400AN-4FGG676C

    XC3S1400AN-4FGG676C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC2S100-5PQ208I

    XC2S100-5PQ208I

    XC2S100-5PQ208I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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