XC3S1500-4FGG676I Manufacturers

To consistently enhance the management method by virtue of the rule of ""sincerely, fantastic religion and top quality are the base of business development"", we extensively absorb the essence of associated goods internationally, and constantly acquire new merchandise to satisfy the needs of shoppers for XC3S1500-4FGG676I, Now we now have established steady and lengthy company associations with clients from North America, Western Europe, Africa, South America, extra than 60 countries and regions.
XC3S1500-4FGG676I, We are sincerely looking forward to cooperate with customers all over the world. We believe we can satisfy you with our high-quality goods and perfect service . We also warmly welcome customers to visit our company and purchase our solutions.

Hot Products

  • 5SGXMA3H2F35C3G

    5SGXMA3H2F35C3G

    ​5SGXMA3H2F35C3G is an Intel/Altera brand FPGA (Field Programmable Gate Array) belonging to Stratix ® V GX series. This chip is packaged in FBGA-1152 and is suitable for high-performance applications such as data centers, communications, and computer vision.
  • Multilayer precision PCB

    Multilayer precision PCB

    Multilayer precision PCB--The manufacturing method of multilayer board is generally made by the inner layer pattern first, and then the single or double-sided substrate is made by printing and etching method, which is included in the specified interlayer, and then heated, pressurized and bonded. As for the subsequent drilling, it is the same as the plating through-hole method of double-sided board.
  • MC24M Buried capacitance PCB

    MC24M Buried capacitance PCB

    MC24M Buried capacitance PCB--Ordinary chip capacitors are placed on empty PCBs through SMT; buried capacitance is to integrate new buried capacitance materials into PCB / FPC, which can save PCB space and reduce EMI / noise suppression, etc. Currently answering MEMS microphones And communications have been widely used.The following is about MC24M Buried Capacitor PCB related, I hope to help you better understand MC24M Buried Capacitor PCB.
  • XCZU47DR-2FFVE1156I

    XCZU47DR-2FFVE1156I

    ​XCZU47DR-2FFVE1156I Embedded System on Chip (SoC) is a single-chip adaptive RF platform that can meet current and future industry needs. The Zynq UltraScale+RFSoC series can support all frequency bands below 6GHz, meeting the critical requirements of next-generation 5G deployment. At the same time, it can also support direct RF sampling for 14 bit analog-to-digital converters (ADCs) with a sampling rate of up to 5GS/S and 14 bit analog-to-digital converters (DACs) with a sampling rate of 10 GS/S, both of which have an analog bandwidth of up to 6GHz.
  • XCKU025-1FFVA1156I

    XCKU025-1FFVA1156I

    ​XCKU025-1FFVA1156I is an ideal choice for packet processing and DSP intensive functions, suitable for various applications ranging from wireless MIMO technology to Nx100G networks and data centers.
  • XCVU160-2FLGB2104I

    XCVU160-2FLGB2104I

    ​XCVU160-2FLGB2104I is a high-performance FPGA (Field Programmable Gate Array) launched by Xilinx, which is part of the Virtex UltraScale series. This FPGA uses second-generation 3D IC technology and is designed to provide high performance and integration

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