XC3S1500-4FGG676I Manufacturers

To consistently enhance the management method by virtue of the rule of ""sincerely, fantastic religion and top quality are the base of business development"", we extensively absorb the essence of associated goods internationally, and constantly acquire new merchandise to satisfy the needs of shoppers for XC3S1500-4FGG676I, Now we now have established steady and lengthy company associations with clients from North America, Western Europe, Africa, South America, extra than 60 countries and regions.
XC3S1500-4FGG676I, We are sincerely looking forward to cooperate with customers all over the world. We believe we can satisfy you with our high-quality goods and perfect service . We also warmly welcome customers to visit our company and purchase our solutions.

Hot Products

  • Al2O3 PCB

    Al2O3 PCB

    Al2O3 PCB has excellent corrosion resistance, and has high thermal conductivity, excellent chemical stability and thermal stability, and other properties that organic substrates do not have. Aluminum Nitride Ceramic base board an ideal packaging material for a new generation of large-scale integrated circuits and power electronic modules. The following is about Al2O3 PCB I hope to help you better understand Al2O3 PCB.
  • XC6VLX240T-2FFG1156C

    XC6VLX240T-2FFG1156C

    XC6VLX240T-2FFG1156C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 5CGXFC4C7F27C8N

    5CGXFC4C7F27C8N

    5CGXFC4C7F27C8N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • TU-1300E High-speed PCB

    TU-1300E High-speed PCB

    TU-1300E High-speed PCB -- expedition unified design environment combines FPGA design and PCB design completely, and automatically generates schematic symbols and geometric packaging in PCB design from FPGA design results, which greatly improves the design efficiency of designers.
  • XCVU29P-L2FSGA2577E

    XCVU29P-L2FSGA2577E

    ​XCVU29P-L2FSGA2577E is an electronic component from Xilinx, belonging to the Virtex UltraScale+series, with the following features and specifications:
  • LSF0108RKSR

    LSF0108RKSR

    LSF0108RKSR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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