XC3S1400A-4FGG484C Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XC6SLX150-2CSG484I

    XC6SLX150-2CSG484I

    ​The XC6SLX150-2CSG484I series, consisting of 13 members, provides an expansion density from 3840 to 147443 logical units, with power consumption half that of the previous Spartan series, and offers faster and more comprehensive connectivity.
  • HI-8422PQTF

    HI-8422PQTF

    ​HI-8422PQTF is a 16 channel discrete to digital interface circuit produced by Holt Integrated Circuits
  • XCKU035-1FBVA676C

    XCKU035-1FBVA676C

    XCKU035-1FBVA676C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7K70T-1FBG484I

    XC7K70T-1FBG484I

    ​XC7K70T-1FBG484I is widely used in communication infrastructure, wired/wireless communication systems, video and image processing, industrial control and automation systems, aerospace and defense electronics, testing and measurement instruments, and other fields. It provides rich logic resources, DSP resources, and high-speed serial interfaces to meet the demanding performance requirements of various mid to high end FPGA applications.
  • BCM88682CA1KFSBG

    BCM88682CA1KFSBG

    ​BCM88682CA1KFSBG is an electronic component designed and produced by Broadcom brand, with the following characteristics:
  • XCVU7P-2FLVA2104I

    XCVU7P-2FLVA2104I

    The XCVU7P-2FLVA2104I device provides the highest performance and integrated functionality on 14nm/16nm FinFET nodes. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements. It also provides a virtual single-chip design environment to provide registered routing lines between chips to achieve operation above 600MHz and provide richer and more flexible clocks.

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