XAZU3EG-1SFVC784Q Manufacturers

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Hot Products

  • XCVU13P-3FLGA2577E

    XCVU13P-3FLGA2577E

    XCVU13P-3FLGA2577E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 9FG108EFILFT

    9FG108EFILFT

    9FG108EFILFT is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • MT41J128M16HA 15E:D

    MT41J128M16HA 15E:D

    MT41J128M16HA 15E:D is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU25DR-1FFVG1517E

    XCZU25DR-1FFVG1517E

    XCZU25DR-1FFVG1517E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC5VSX50T-3FFG665C

    XC5VSX50T-3FFG665C

    XC5VSX50T-3FFG665C is an advanced field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 49,920 logic cells, 2.7 Mb of distributed RAM, and 400 Digital Signal Processing (DSP) slices, making it suitable for a wide range of high-performance applications. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The -3 speed grade of this FPGA allows it to operate up to 500 MHz. The device comes in a flip-chip fine-pitch ball grid array (FFG665C) package with 665 pins, providing high pin-count connectivity for a variety of applications. XC5VSX50T-3FFG665C is commonly used in industrial automation, aerospace and defense, telecom, and high-performance computing applications. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it an excellent choice for mission-critical and high-reliability applications.
  • XC6SLX9-2CSG324I

    XC6SLX9-2CSG324I

    ​XC6SLX9-2CSG324I, Field Programmable Gate Array (FPGA), 9152 Cells, 45nm (CMOS) Technology, 1.2V, produced by Xilinx factory, CSBGA-324 package

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