TU-933 high-speed backplane Manufacturers

Our staff are generally while in the spirit of "continuous improvement and excellence", and while using the excellent high quality merchandise, favorable value and great after-sales services, we try to gain each customer's have faith in for TU-933 high-speed backplane,TU-883 high-speed backplane,TU-872 high speed PCB, Adhering for the enterprise philosophy of 'customer initial, forge ahead', we sincerely welcome consumers from in the home and abroad to cooperate with us.
TU-933 high-speed backplane, we've been sincerely hope to establish one good long term business relationship with your esteemed company thought this opportunity, based on equal, mutual beneficial and win win business from now till the future.

Hot Products

  • Robot 3step HDI PCB

    Robot 3step HDI PCB

    The heat resistance of the Robot 3step HDI PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.
  • Ceramic PCB

    Ceramic PCB

    Ceramic PCB substrate is a 96% aluminum oxide ceramic double-sided copper clad substrate, which is mainly used in high-power module power supplies, high-power LED lighting substrates, solar photovoltaic substrates, high-power microwave power devices, which have high thermal conductivity, high pressure resistance, high temperature resistance, solderability resistance.
  • GA100-875GG1-A1

    GA100-875GG1-A1

    GA100-875GG1-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • P5040NXN72QC

    P5040NXN72QC

    P5040NXN72QC is a microchip launched by NXP, operating temperature -40°C~105°C(TA), speed 2.2GHz, supplier device package 1295-FCPBGA(37.5x37.5)
  • AD830ARZ

    AD830ARZ

    AD830ARZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A35T-1CSG325C

    XC7A35T-1CSG325C

    ​The XC7A35T-1CSG325C Artix TM -7 device provides a high-performance power architecture, transceiver line speed, DSP processing capability, and AMS integration in a single cost optimized FPGA. Including MicroBlaze ™ Supported by a soft processor and 1066Mb/s DDR3 technology, this series provides maximum value for various cost and power sensitive applications, including software defined radio, machine vision photography, and low-end wireless backhaul.

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