RO4003C with mixed circuit board Manufacturers

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Hot Products

  • 5M570ZT144C5N

    5M570ZT144C5N

    ​The 5M570ZT144C5N low-cost and low-power CPLD provides greater density and I/O per footprint. The density of MAX V devices ranges from 40 to 2210 logic elements (32 to 1700 equivalent macro units) and up to 271 I/O, providing programmable solutions for I/O expansion, bus and protocol bridging, power monitoring and control, FPGA configuration, and analog IC interfaces.
  • R5775G High-speed PCB

    R5775G High-speed PCB

    It is generally believed that if the frequency of a digital logic circuit reaches or exceeds 45MHZ ~ 50MHZ, and the circuit operating above this frequency has already occupied a certain portion of the entire electronic system (say 1/3), it is called a high-speed circuit. The following is about R5775G High-speed PCB related, I hope to help you better understand R5775G High-speed PCB.
  • XC3S4000-4FG676C

    XC3S4000-4FG676C

    XC3S4000-4FG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S400-4FTG256C

    XC3S400-4FTG256C

    XC3S400-4FTG256C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7S50-2FGGA484C

    XC7S50-2FGGA484C

    XC7S50-2FGGA484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Ro3003 Material

    Ro3003 Material

    Ro3003 Material is a high frequency circuit material filled with PTFE composite material, which is used in commercial microwave and RF applications. The product series aims to provide excellent electrical and mechanical stability at competitive prices. Rogers ro3003 has excellent dielectric constant stability over the entire temperature range, including eliminating the change of dielectric constant when using PTFE glass at room temperature. In addition, the loss coefficient of the ro3003 laminate is as low as 0.0013 to 10 GHz.

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