Model number:XCVU13P-2FLGA2577I Manufacturers

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Model number:XCVU13P-2FLGA2577I, With the goal of "zero defect". To care for the environment, and social returns, care employee social responsibility as own duty. We welcome friends from all over the world to visit and guide us so that we can achieve the win-win goal together.

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    XCVU13P-2FHGB2104I

    XCVU13P-2FHGB2104I Overview of RF Data Converter Subsystem Most Zynq UltraScale+RFSoCs include an RF data converter subsystem that includes multiple radios Frequency analog-to-digital converter (RF-ADC) and multiple RF analog-to-digital converters
  • BCM87400A1KRFBG

    BCM87400A1KRFBG

    ​The BCM87400A1KRFBG adopts Broadcom's leading PAM-4 PHY technology platform and is the industry's first 400G PAM-4 PHY transceiver using nm CMOS technology.
  • XC2S100E-6PQG208C

    XC2S100E-6PQG208C

    XC2S100E-6PQG208C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EP1S25F672C8N

    EP1S25F672C8N

    EP1S25F672C8N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Aluminum nitride ceramic PCB

    Aluminum nitride ceramic PCB

    Aluminum nitride ceramic PCB is a ceramic material with aluminum nitride (AIN) as the main crystal phase, and then the metal circuit is etched on the aluminum nitride ceramic substrate, which is the aluminum nitride ceramic substrate. The thermal conductivity of aluminum nitride is several times higher than that of aluminum oxide, has good thermal shock resistance, and has excellent corrosion resistance. The following is aboutAluminum nitride ceramic, I hope to help you better understand Aluminum nitride ceramic.
  • XC3S400-4PQG208I

    XC3S400-4PQG208I

    XC3S400-4PQG208I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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