Products
Home > Products > Meg6 High-speed Backplane

Meg6 High-speed Backplane Manufacturers

We always think and practice corresponding to the change of circumstance, and grow up. We goal at the achievement of a richer mind and body and also the living for Meg6 High-speed Backplane,megtron6 high-speed backplane,megtron7 high-speed PCB,megtron4 high-speed PCB,high-speed PCB, Make sure you sense absolutely absolutely free to speak to us for organization. nd we believe we are going to share the ideal trading practical experience with all our merchants.
Meg6 High-speed Backplane, Our company has already had a lot of top factories and expert technology teams in China, offering the best solutions, techniques and services to worldwide customers. Honesty is our principle, professional operation is our work, service is our goal, and customers' satisfaction is our future!

Related Products

Hot Products

  • XCZU6EG-1FFVC900E

    XCZU6EG-1FFVC900E

    ​XCZU6EG-1FFVC900E - Zynq® UltraScale+ ™ MPSoC multi-core processor
  • Nelco PCB

    Nelco PCB

    Nelco PCB is considered to be the best PCB material in PCB industry, so it is undoubtedly the best material choice. We have prepared sufficient inventory to meet your fast demand for Nelco PCB in small and medium volume. Models are N4000-13, N4000-13ep, N4000-13epsi, NY9220, NY9233, NY9300, N9300-13RF, etc
  • Medical Equipment HDI PCB

    Medical Equipment HDI PCB

    HDI imaging, while achieving low defect rate and high output, can achieve stable production of HDI conventional high-precision operation. For example: advanced mobile phone board, CSP pitch is less than 0.5mm. The board structure is 3 + n + 3, there are three superposed vias on each side, and 6 to 8 layers of coreless printed boards with superimposed vias.The following is about Medical Equipment HDI PCB related, I hope to help you better understand Medical Equipment HDI PCB.
  • XC3S2000-4FGG676C

    XC3S2000-4FGG676C

    XC3S2000-4FGG676C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCKU040-1FFVA1156E

    XCKU040-1FFVA1156E

    ​XCKU040-1FFVA1156E also adopts advanced 16 nanometer technology, which can achieve higher integration and lower power consumption. In addition, the chip also has high programmability and flexibility, which can meet the needs of different application scenarios.
  • TPS74901RGWR

    TPS74901RGWR

    TPS74901RGWR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

Related Search

32-Layer Meg6 High-speed Backplane

Send Inquiry