Meg6 High-speed Backplane Manufacturers

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Hot Products

  • VT-47 PCB

    VT-47 PCB

    34-Layer VT-47 PCB It is generally agreed that if the line propagation delay is greater than the rise time of the 1/2 digital signal drive terminal, such signals are considered to be high-speed signals and produce transmission line effects. The following is about 34 Layer VT-47 PCB related, I hope to help you better understand 34 Layer VT-47 PCB.
  • Ceramic PCB

    Ceramic PCB

    Ceramic PCB substrate is a 96% aluminum oxide ceramic double-sided copper clad substrate, which is mainly used in high-power module power supplies, high-power LED lighting substrates, solar photovoltaic substrates, high-power microwave power devices, which have high thermal conductivity, high pressure resistance, high temperature resistance, solderability resistance.
  • EP3C5M164I7N

    EP3C5M164I7N

    EP3C5M164I7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10CL016YF484I7G

    10CL016YF484I7G

    ​10CL016YF484I7G Intel 10CL016YF484I7G Cyclone ® The 10 LP FPGA has been optimized for low cost and low static power consumption, making it an ideal choice for large-scale and cost sensitive applications. The Intel Cyclone 10 LP device provides high-density programmable gates, onboard resources, and general-purpose I/O. These resources can meet the requirements of I/O expansion and chip to chip interface
  • XC5VLX155T-1FFG1136C

    XC5VLX155T-1FFG1136C

    XC5VLX155T-1FFG1136C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX9-2CSG225C

    XC6SLX9-2CSG225C

    XC6SLX9-2CSG225C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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