LTM8003IY#PBF Manufacturers

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Hot Products

  • 10CX105YF672E6G

    10CX105YF672E6G

    10CX105YF672E6G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU440-2FLGA2892C

    XCVU440-2FLGA2892C

    ​XCVU440-2FLGA2892C is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Virtex UltraScale series. Here is a brief introduction to the chip:
  • 5SGXEA7N2F45I3N

    5SGXEA7N2F45I3N

    The 5SGXEA7N2F45I3N is a Field-Programmable Gate Array (FPGA) device manufactured by Intel (formerly Altera Corporation), belonging to the Stratix® V GX series. This device offers a combination of advanced features and capabilities
  • XCKU115-2FLVB1760E

    XCKU115-2FLVB1760E

    XCKU115-2FLVB1760E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CSEMA5U23A7N

    5CSEMA5U23A7N

    5CSEMA5U23A7N is one of Intel's Cyclone V series FPGA products, which combines high performance and low power consumption and is widely used in fields such as digital signal processing, embedded processing, and communication
  • 13 layer R5775G high-speed PCB

    13 layer R5775G high-speed PCB

    In the design of 13 layer R5775G high-speed PCB, the main problems that must be considered are signal integrity, electromagnetic compatibility and thermal noise. Generally, when the signal frequency is higher than 30MHz, the signal distortion must be prevented. When the frequency is higher than 66MHz, the signal integrity must be analyzed.

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