KSZ8851SNLI Manufacturers

XCKU3P-1FFVB676E is a high-performance FPGA (Field Programmable Gate Array) produced by Xilinx in the Kintex UltraScale+series. This FPGA integrates millions of logic units, a large number of high-speed serial transceivers, large capacity block RAM, and advanced DSP units, forming a powerful computing platform that can meet the needs of complex algorithm processing, high-speed data transmission, and large-scale parallel processing

XCVU13P-2FHGB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 1.3 million logic cells, 50 Mb of block RAM, and 624 Digital Signal Processing (DSP) slices, making it ideal for high-performance applications such as high-performance computing, machine vision, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 1 GHz. The device comes in a flip-chip BGA (FHGB2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU13P-2FHGB2104E is commonly used in advanced systems such as wireless communications, cloud computing, and high-speed networking. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.

​XCKU115-2FLVA1517E is an FPGA chip produced by Xilinx, belonging to the Kintex UltraScale architecture, with high performance and low power consumption characteristics. This chip adopts second-generation 3D integrated circuit technology and has over 1.5 million system logic units and 624 input/output ports, which can be flexibly configured for various applications

Multilayer PCB refers to a printed circuit board with more than three conductive pattern layers and insulating materials between them, and the conductive patterns are interconnected according to the requirements. Multilayer circuit board is the product of the development of electronic information technology to high speed, multi-function, large capacity, small size, thin and lightweight.

HI-8584PQTF-10 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

​XC3S1400A-4FGG484C is an FPGA (Field Programmable Gate Array) produced by Xilinx, with the following features and specifications: