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FPGA, Further, we're supported by highly experienced and knowledgeable professionals, who have immense expertise in their respective domain. These professionals work in close coordination with each other to provide our clients an effective range of products and solutions.

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  • Robot 3step HDI PCB

    Robot 3step HDI PCB

    The heat resistance of the Robot 3step HDI PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.
  • XC3S50AN-4TQG144I

    XC3S50AN-4TQG144I

    XC3S50AN-4TQG144I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM56321B1KFSBG

    BCM56321B1KFSBG

    ​BCM56321B1KFSBG is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.
  • super big size PCB

    super big size PCB

    super big size PCB The advantages of large size PCB lie in one-time and integrity, which reduces the confusion and trouble of piecewise connection, but the cost is relatively high.
  • XC7A35T-1FGG484I

    XC7A35T-1FGG484I

    XC7A35T-1FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX1140T-3FLG1928I

    XC7VX1140T-3FLG1928I

    XC7VX1140T-3FLG1928I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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  • Reviews

  • What are the advantages of PCB components

    From common electronic systems to some complex mechanical and electrical engineering systems, they are composed of a large number of parts of different specifications and types. Nowadays, with the development of PCB related technology, the application value of these parts has also been recognized by more fields. Manufacturers specializing in the design, research and development of these parts and technical process research have also entered the cooperation scope of many large brand enterprises. Next, analyze the three outstanding advantages of PCB:

  • What is a high-speed PCB design?

    ‌High-speed PCB design‌ refers to circuit boards designed for transmitting high-speed signals, which are usually transmitted at speeds in GHz (gigahertz).

  • May the Chirstmas be a time of laughter and real enjoyment for you

    HONTEC thanks everyone for your continued support and hopes that we can have better cooperation in the future.

  • What is RF PCB board?

    RF PCB, means radio frequency PCB. People also called these PCB High frequency PCB, it is for the PCB with a higher electromagnetic frequency, and it is used on the products field with high frequency. (Frequency greater than 300MHZ or wavelength less than 1 meter) and microwave (frequency greater than 3GHZ or wavelength less than 0.1 meter). It is made by microwave substrate with common PCB manufacturing process or with some special way to make.

  • Difference between missing printing covering layer and laminated covering film of FPC circuit board

    After the covering film of FPC circuit board is positioned, it is necessary to heat and pressurize to make the adhesive completely solidified and integrated with the circuit.

  • What are the types of PCB aluminum substrates of PCB manufacturers

    At present, the commonly used LED aluminum substrate has two sides: the white side is used for welding led pins, and the other side shows the natural color of aluminum.

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