EPM3064ATC44-10 Manufacturers

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Hot Products

  • EP2C35F672C8N

    EP2C35F672C8N

    EP2C35F672C8N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 8MM Thick Megtron4 PCB

    8MM Thick Megtron4 PCB

    The success of a product depends on its internal quality. Second, it takes into account the overall beauty. Both are perfect to be considered successful. On a PCB board, the layout of the components needs to be balanced, dense and orderly, not top-heavy or heavy. The following is about 36 Layer 8MM Thick Megtron4 PCB related, I hope to help you better understand 36 Layer 8MM Thick Megtron4 PCB.
  • Heavy copper PCB

    Heavy copper PCB

    Printed circuit boards are usually bonded with a layer of copper foil on glass epoxy substrate. The thickness of copper foil is usually 18 μ m, 35 μ m, 55 μ m and 70 μ M. The most commonly used copper foil thickness is 35 μ M. When the weight of copper is more than 70UM, it is called heavy copper PCB
  • XC6SLX100-3FGG484C

    XC6SLX100-3FGG484C

    XC6SLX100-3FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU11P-1FLGC2104E

    XCVU11P-1FLGC2104E

    ​The XCVU11P-1FLGC2104E FPGA device provides the highest performance and integrated functionality on a 14nm/16nm FinFET node.
  • LSF0108RKSR

    LSF0108RKSR

    LSF0108RKSR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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