XCVU11P-1FLGC2104E

XCVU11P-1FLGC2104E

​The XCVU11P-1FLGC2104E FPGA device provides the highest performance and integrated functionality on a 14nm/16nm FinFET node.

Model:XCVU11P-1FLGC2104E

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Product Description

The XCVU11P-1FLGC2104E FPGA device provides the highest performance and integrated functionality on a 14nm/16nm FinFET node. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements.

Product attributes

Series: XCVU11P

Number of logic components: 2835000 LE

Adaptive Logic Module - ALM: 162000 ALM

Embedded memory: 70.9 Mbit

Number of input/output terminals: 512 I/O

Power supply voltage - minimum: 850 mV

Power Supply Voltage - Maximum: 850 mV

Minimum operating temperature: 0 ° C

Maximum operating temperature:+100 ° C

Data rate: 32.75 Gb/s

Number of transceivers: 96 transceivers

Installation style: SMD/SMT

Package/Box: FBGA-2104

Distributed RAM: 36.2 Mbit

mbedded Block RAM - EBR: 70.9 Mbit

Humidity sensitivity: Yes

Number of logical array blocks - LAB: 162000 LAB

Working power supply voltage: 850 mV


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