EP3SL110F780C3G Manufacturers

It really is a good way to further improve our goods and service. Our mission would be to acquire inventive items to buyers with a very good encounter for EP3SL110F780C3G, We are keeping durable business relationships with more than 200 wholesalers in the USA, the UK, Germany and Canada. If you are interested in any of our products, please feel free to contact us.
EP3SL110F780C3G, So far our merchandise have been exported to east Europe, the Middle East, Southeast, Africa and South America etc. We've 13years expert sales and purchase in Isuzu parts at home and abroad and the ownership of the modernized electronic Isuzu parts checking systems. We honor our core principal of Honesty in business, priority in service and will do our best to provide our customers with high quality goods and excellent service.

Hot Products

  • Step Gold finger PCB

    Step Gold finger PCB

    The golden finger is composed of many golden yellow conductive contacts. It is called "golden finger" because its surface is gilded and the conductive contacts are arranged like fingers. The step gold finger PCB is actually coated with a layer of gold on the copper clad laminate by a special process, because the gold has strong oxidation resistance and strong conductivity.
  • XCVU9P-2FLGA2104I

    XCVU9P-2FLGA2104I

    As a member of the FPGA chip, XCVU9P-2FLGA2104I has 2304 programmable logic units (PLs) and 150MB of internal memory, providing a clock frequency of up to 1.5 GHz. Provided 416 input/output pins and 36.1 Mbit distributed RAM. It supports field programmable gate array (FPGA) technology and can achieve flexible design for various applications
  • LTM4628EV#PBF

    LTM4628EV#PBF

    ​LTM4628EV#PBF also supports frequency synchronization, multi-phase operation, burst mode operation, and output voltage tracking functions for power rail sorting. It adopts a space saving design while having good heat resistance, and the pin coating complies with SnPb (BGA) or RoHS standards.
  • XC2S300E-6FG456C

    XC2S300E-6FG456C

    XC2S300E-6FG456C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU115-3FLVA1924E

    XCKU115-3FLVA1924E

    The XCKU115-3FLVA1924E architecture includes high-performance FPGA, MPSoC, and RFSoC series, which can meet a wide range of application requirements. System requirements, with a focus on reducing total power consumption through numerous innovative technologies
  • XCZU19EG-3FFVB1517E

    XCZU19EG-3FFVB1517E

    ​XCZU19EG-3FFVB1517E is an embedded system on chip (SoC) produced by Xilinx. This product belongs to the Zynq UltraScale+series and has the following key features and functions:

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