EP3SE80F1152I4N Manufacturers

"Sincerity, Innovation, Rigorousness, and Efficiency" is the persistent conception of our firm for that long-term to acquire with each other with buyers for mutual reciprocity and mutual reward for EP3SE80F1152I4N, We've been usually looking ahead to forming profitable company interactions with new clientele within the earth.
EP3SE80F1152I4N, Our product quality is one of the major concerns and has been produced to meet the customer's standards. "Customer services and relationship" is another important area which we understand good communication and relationships with our customers is the most significant power to run it as a long term business.

Hot Products

  • XCVU19P-1FSVB3824E

    XCVU19P-1FSVB3824E

    ​XCVU19P-1FSVB3824E is an FPGA (Field Programmable Gate Array) produced by Xilinx, belonging to the Virtex UltraScale+series. This FPGA has the following key features:
  • EPM3128ATC100-10N

    EPM3128ATC100-10N

    EPM3128ATC100-10N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC3S100E-4TQG144C

    XC3S100E-4TQG144C

    XC3S100E-4TQG144C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Blind Buried Hole PCB

    Blind Buried Hole PCB

    Buried vias: Buried vias only connect the traces between the inner layers, so they are not visible from the PCB surface. Such as 8layer board, the holes of 2-7 layers are buried holes.The following is about Mechanical Blind Buried Hole PCB related, I hope to help you better understand Mechanical Blind Buried Hole PCB.
  • XC3S1400A-5FGG484C

    XC3S1400A-5FGG484C

    XC3S1400A-5FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC5VLX50T-1FFG665C

    XC5VLX50T-1FFG665C

    XC5VLX50T-1FFG665C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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