Products
Home > Products > EP3SE110F1152I3N

EP3SE110F1152I3N Manufacturers

"Based on domestic market and expand overseas business" is our enhancement strategy for EP3SE110F1152I3N, Currently, we are seeking ahead to even bigger cooperation with abroad buyers determined by mutual benefits. Please sense absolutely free to contact us for more details.
EP3SE110F1152I3N, To create more creative products and solutions, maintain high-quality goods and update not only our products and solutions but ourselves so as to keep us ahead of the world, and the last but most vital one: to make every client satisfied with everything we present and to grow stronger together. To be the real winner, starts here!

Related Products

Hot Products

  • XC7K160T-1FFG676C

    XC7K160T-1FFG676C

    XC7K160T-1FFG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC9572-10TQG100C

    XC9572-10TQG100C

    XC9572-10TQG100C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCKU15P-L2FFVA1156E

    XCKU15P-L2FFVA1156E

    XCKU15P-L2FFVA1156E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM84074AIFSBLG

    BCM84074AIFSBLG

    BCM84074AIFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Thin Film Circuit Board

    Thin Film Circuit Board

    Thin film circuit board has good thermal and electrical properties, and is an excellent material for power LED packaging. Thin film circuit board is especially suitable for packaging structures such as multi-chip (MCM) and substrate directly bonded chip (COB); it can also be used as other high-power The heat dissipation circuit board of the power semiconductor module.
  • XCKU15P-3FFVA1760E

    XCKU15P-3FFVA1760E

    The XCKU15P-3FFVA1760E device can achieve a balance between required system performance and extremely low power consumption, while supporting packet processing and DSP intensive functions. It is an ideal choice for wireless MIMO technology, Nx100G wired networks, as well as data center networks and storage acceleration application
  • Related Blog
  • Reviews

  • What is an HDI (High Density Interconnect) PCB?

    High Density Interconnection (HDI) PCB is a kind of (technology) for the production of printed circuit boards. It is a circuit board with relatively high circuit distribution density using micro blind via and buried via technology.

  • The origin and development of PCB

    PCB (printed circuit board), whose Chinese name is printed circuit board, is one of the important components in the electronic industry. Almost every kind of electronic equipment, from electronic watches and calculators to computers,

  • Do you really know about FPCs

    of FPC is becoming more and more significant in order to achieve more functions. Now Jin Baize will talk about the characteristics of FPC on the advantages and disadvantages of FPC.

  • Causes and solutions of blistering in multilayer circuit boards

    Reasons for blistering of multilayer circuit board

  • Introduction to semiconductor

    Germanium, silicon, selenium, gallium arsenide and many metal oxides, metal sulfides and other objects, whose conductivity is between conductor and insulator, are called semiconductors. Semiconductors have some special properties. For example, the thermistor (thermistor) for automatic control can be made by using the relationship between the resistivity and temperature of the semiconductor; Using its photosensitive characteristics, photosensitive elements for automatic control can be made, such as photocells, photocells and photoresistors

  • Analysis of PCB Factory Automation and Industry 4.0 Planning

    The main purpose of PCB factory automation and smart factory design investment is to save labor costs, improve product yield, reduce operation intensity and effectively arrange production in order to achieve effective coordination of various processes and optimal operation of the factory.

Send Inquiry