Products
Home > Products > EP3C55F484I7N

EP3C55F484I7N Manufacturers

Our primary objective is usually to offer our shoppers a serious and responsible small business relationship, offering personalized attention to all of them for EP3C55F484I7N, Leading the trend of this field is our persistent objective. Supplying 1st class products and solutions is our intention. To make a beautiful long term, we would want to cooperate with all friends at your house and abroad. Should you've any interest within our products, remember to usually do not be reluctant to get in touch with us.
EP3C55F484I7N, We have been introduced as a one of the growing manufacture supplier and export of our merchandise. We've got a team of dedicated trained experienced who take care the quality and timely supply. If you are looking for Good Quality at a good price and timely delivery. Do contact us.

Related Products

Hot Products

  • BCM54616SC0HKFBG

    BCM54616SC0HKFBG

    BCM54616SC0HKFBG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XA7A50T-1CPG236Q

    XA7A50T-1CPG236Q

    XA7A50T-1CPG236Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CGXFC5F6M11I7N

    5CGXFC5F6M11I7N

    5CGXFC5F6M11I7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 8OZ Heavy copper PCB

    8OZ Heavy copper PCB

    In PCB proofing, a layer of copper foil is bonded to the outer layer of FR-4. When the copper thickness is = 8oz, it is defined as a 8OZ heavy copper pcb. The 8OZ heavy copper pcb has excellent extension performance, high temperature, low temperature, and corrosion resistance, which allows electronic equipment products to have a longer service life, and also greatly helps the size of electronic equipment to be simplified. In particular, electronic products that need to run higher voltages and currents require 8OZ heavy copper pcb.
  • BCM65040IMLG

    BCM65040IMLG

    BCM65040IMLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2S50-5PQG208C

    XC2S50-5PQG208C

    XC2S50-5PQG208C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Related Blog
  • Reviews

  • Installation mode of components on PCB printed circuit board

    Our common computer boards and cards are basically epoxy resin glass cloth based double-sided printed circuit boards. One side is the plug-in components, and the other side is the welding surface of the component feet. It can be seen that the welding points are very regular

  • What are the forms of integrated circuits

    Integrated circuits (ICs), also known as microchips or simply chips, are fundamental components of modern electronics.

  • Film selection of FPC circuit board

    There are three methods of resist coating: liquid resist coating method and FPC resist coating method for circuit board

  • Dongbao Circuit Board Industrial Park to build a park with an annual output value of 10 billion yuan

    According to the relevant person in charge of the management committee of Dongbao Industrial Park, the park has officially entered 6 companies, including Meidian, Weide, and Jiuxiang have been put into production, Jinrun Dingsheng is debugging equipment, Hongxin Huayin, Yongchuangxin are under construction Plant.

  • PCB production, you must pay attention to these matters!

    Cutting, fillet, edge grinding, baking, inner pretreatment, coating, exposure, DES (development, etching, film removal), punching, AOI inspection, VRS repair, browning, lamination, pressing, drilling target, gong edge, drilling, copper plating, film pressing, printing, text, surface treatment, final inspection, packaging, and other processes are extremely numerous. It sounds great, but the process is so long, and there are many problems to pay attention to.

  • HDI board application

    HDI is widely used in mobile phones, digital (camera) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are generally manufactured by the build-up method.

Send Inquiry