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Hot Products

  • Medical ultrasound probe FPC

    Medical ultrasound probe FPC

    Medical ultrasound probes are devices that transmit and receive ultrasound during the ultrasound testing process. The performance of the probe directly affects the characteristics of ultrasonic waves and the detection performance of ultrasonic waves.The following is about Medical ultrasound probe FPC related, I hope to help you better understand Medical ultrasound probe FPC.
  • XC5VFX70T-1FFG1136C

    XC5VFX70T-1FFG1136C

    ​XC5VFX70T-1FFG1136C is a Virtex-5 series FPGA chip produced by Xilinx. The chip is packaged in BGA and has 640 input/output ports, making it a programmable logic device. Its main features include high performance, rich logical units and I/O resources, suitable for various complex application scenarios.
  • HI-8445PSI

    HI-8445PSI

    HI-8445PSI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU7EG-1FBVB900Q

    XCZU7EG-1FBVB900Q

    ​XCZU7EG-1FBVB900Q is a SoC FPGA (System on Chip Field Programmable Gate Array) product from Xilinx. However, a detailed introduction directly targeting XCZU7EG-1FBVB900Q may not be listed directly in the search results you provide, but I can provide an overview of its possible features and specifications based on the general characteristics of Xilinx's SoC FPGA series and information on similar products. ‌
  • HI-8426PCIF

    HI-8426PCIF

    HI-8426PCIF is an integrated circuit produced by HOLT IntegraTED CIRCUITS, specifically an 8-channel discrete to digital sensor that integrates specific functional characteristics
  • XCKU5P-2FFVB676I

    XCKU5P-2FFVB676I

    XCKU5P-2FFVB676I is a high-performance FPGA (Field-Programmable Gate Array) chip from Xilinx's Kintex UltraScale+ family. It features 5.3 million logic cells, 113 Mb of UltraRAM and 2,722 DSP slices, and utilizes the 20nm process technology with FinFET+ technology, providing high performance and energy efficiency.

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