EP2AGX125EF29C6G Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • TU-943N High-speed PCB

    TU-943N High-speed PCB

    TU-943N High-speed PCB -- the development of electronic technology is changing with each passing day. This change mainly comes from the progress of chip technology. With the wide application of deep submicron technology, semiconductor technology is becoming increasingly physical limit. VLSI has become the mainstream of chip design and application.
  • 5CEBA9F23C8N

    5CEBA9F23C8N

    ​5CEBA9F23C8N is a Cyclone V series FPGA chip produced by Intel Corporation, which has a wide range of application prospects.
  • XC7K480T-2FFG901I

    XC7K480T-2FFG901I

    ​The XC7K480T-2FFG901I FPGA is an ideal choice for applications such as 3G/4G wireless, flat panel displays, and video over IP solutions. The Kinex? 7 FPGA allows designers to achieve excellent cost/performance/power balance at 28nm nodes, while providing high DSP rate, cost-effective packaging, and supporting PCIe ® Mainstream standards such as Gen3 and 10 Gigabit Ethernet.
  • XC95288XL-10PQG208C

    XC95288XL-10PQG208C

    XC95288XL-10PQG208C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 13 layer R5775G high-speed PCB

    13 layer R5775G high-speed PCB

    In the design of 13 layer R5775G high-speed PCB, the main problems that must be considered are signal integrity, electromagnetic compatibility and thermal noise. Generally, when the signal frequency is higher than 30MHz, the signal distortion must be prevented. When the frequency is higher than 66MHz, the signal integrity must be analyzed.
  • XC18V04VQG44C

    XC18V04VQG44C

    XC18V04VQG44C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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