EP1C4F400C8N Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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XCVU57P-3FSVK2892E
XCVU57P-3FSVK2892E is an FPGA field programmable gate array produced by Xilinx and packaged in BGA-2892. This FPGA has high programmability, allowing users to configure and optimize according to specific application requirements. It is suitable for complex application scenarios that require high-performance computing
5CGXFC7D6F27C7N
5CGXFC7D6F27C7N is a Cyclone V GX series FPGA chip produced by Intel (formerly Altera). The chip is packaged in FBGA-672 and has 149500 logic units and 336 I/O ports, supporting system programmability and reprogramming. Its working power supply voltage range is 1.07V to 1.13V
EM-890K HDI PCB
HDI boards are generally manufactured using a lamination method. The more laminations, the higher the technical level of the board. Ordinary HDI boards are basically laminated one time. High-level HDI adopts two or more layered technologies. At the same time, advanced PCB technologies such as stacked holes, electroplated holes, and laser direct drilling are used.The following is about EM-890K HDI PCB related, I hope to help you better understand EM-890K HDI PCB.
XC3S200A-4VQG100C
XC3S200A-4VQG100C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
BCM88470CB0IFSBG
BCM88470CB0IFSBG is based on the seventh generation Dune scalable switching product line. It can be used to build various network switching solutions with flexible I/O interfaces, such as Ethernet or OTN.
XC7K160T-2FFG676C
XC7K160T-2FFG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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Reviews

The future of China's "Core" will be more bright
Just as steel supports the industry, chips support the information industry. Chip R&D and manufacturing capability is the embodiment of a country's high, sophisticated and cutting-edge technology development level.
PCB factory Jianding is aggressively attacking the automotive board market and plans to spend 3 billion yuan to expand the capacity of the Hubei Xiantao plant
PCB factory Jianding Technology is aggressively attacking the automotive board field. On the 21st, the company's board of directors approved a capital increase of 100 million US dollars (about NTD 3 billion) in China's Hubei Xiantao Plant. Demand, the monthly production capacity of 400,000 square feet is expected to be launched in the second quarter.
Semiconductor parts have risen with the wind
Every time through AI flash, Guojin Securities said that semiconductor equipment parts play an important role in the industrial chain, with a large number, a wide variety and obvious market fragmentation characteristics
What are the challenges and opportunities faced by fingerprint identification FPC in the development of 5G in the United States
The US Government Accountability Office (GAO) released a technology assessment and analysis report entitled "5G Wireless Technology" (hereinafter "Report"), which outlines the basic situation of 5G, summarizes the opportunities that 5G can bring, and finally analyzes the United States. Challenges in deploying 5G.
Addressing Coupling Capacitance in Designs
Parasitic coupling between different nets occurs through parasitic inductance and capacitance. Coupling capacitance defines how easily signals can transfer between nets to produce a return path, crosstalk, or overall circuit impedance. Front-end design features in your circuit simulator can help you examine how the coupling capacitance in your nets will influence signal behavior.
What is a chip? How to classify
From "Why are chips stuck" to "How can the shortage of chips be alleviated", we can clearly feel that everyone has a much deeper understanding of the importance of chips. However, when many students contact the chip industry and want to know more, they will still have a variety of questions to answer!

EP1C4F400C8N Manufacturers

Related Products

Hot Products

XCVU57P-3FSVK2892E

5CGXFC7D6F27C7N

EM-890K HDI PCB

XC3S200A-4VQG100C

BCM88470CB0IFSBG

XC7K160T-2FFG676C

The future of China's "Core" will be more bright

PCB factory Jianding is aggressively attacking the automotive board market and plans to spend 3 billion yuan to expand the capacity of the Hubei Xiantao plant

Semiconductor parts have risen with the wind

What are the challenges and opportunities faced by fingerprint identification FPC in the development of 5G in the United States

Addressing Coupling Capacitance in Designs

What is a chip? How to classify

Phyllis 2023-05-09 13:31:51

Gwendolyn 2022-06-27 13:12:53

Fernando 2021-06-07 22:19:57

Cheryl 2022-07-03 18:56:09

Evelyn 2024-07-08 00:24:22

Renee 2020-05-09 13:37:12

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.