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The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    EP2AGZ350HF40I3N

    EP2AGZ350HF40I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM56041A0KFSBLG

    BCM56041A0KFSBLG

    BCM56041A0KFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2S100E-6PQG208C

    XC2S100E-6PQG208C

    XC2S100E-6PQG208C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC3S400-4PQG208C

    XC3S400-4PQG208C

    XC3S400-4PQG208C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC9572XL-7VQ44I

    XC9572XL-7VQ44I

    ​XC9572XL-7VQ44I is a complex programmable logic device (CPLD) produced by Xilinx. This chip has high flexibility and scalability, supporting programming using HDL (Hardware Description Language) such as VHDL and Verilog to meet various complex functional requirements.
  • 5G Optical Module PCB

    5G Optical Module PCB

    10G SFP+ LR is a high performance, cost effective modules, which is supporting Multi Rate 2.4576Gbps to 10.3125Gbps, and transmission distance up to 10km on SM fiber. The transceiver consists of two sections: The transmitter section incorporates a laser driver and a 1310nm DFB laser.The following is about 5G Optical Module PCB related, I hope to help you better understand 5G Optical Module PCB.
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  • Today, we will talk about the knowledge related to chips, hoping to provide some help for everyone to understand chips!

    1. Introduction to chips What is a chip? A chip is an integrated circuit that can be compared to the brain of an electronic device. The components on a chip can perform various tasks, such as processing information, storing data, performing calculations, and controlling operations. Why is it called a chip? "Core" represents the core and center, and "chip" represents a thin piece or fragment. A chip is a thin piece made of semiconductor materials, which, as the core part of the entire circuit system, integrates key circuit structures.

  • Advantages and disadvantages of multilayer boards

    Multilayer boards were invented in 1961. Its production method is generally to make the inner layer graphics first, and then use the printing and etching method to make a single-sided or double-sided substrate, and incorporate it into the designated interlayer, and then heat, press and bond it. As for the subsequent drilling, It is the same as the plated through-hole method of the double-sided board.

  • FPC flexible circuit board through hole mode

    At present, most of the holes drilled in the double-sided flexible printed board are still drilled by the NC drilling machine. The NC drilling machine is basically the same as that used in the rigid printed board, but the drilling conditions are different. Because the flexible printed board is very thin, multiple pieces can be overlapped for drilling. If the drilling conditions are good, 10 ~ 15 pieces can be overlapped for drilling.

  • Multilayer PCB laminated structure

    Before designing multi-layer PCB, the designer needs to first determine the circuit board structure according to the scale of the circuit

  • Advantages of HDI PCB

    1. It can reduce the cost of HDI PCB: When the density of PCB increases to more than eight-layer board, it is manufactured with HDI, and its cost will be lower than that of the traditional complex pressing process.

  • High-precision multi-layer circuit board PCB proofing, four major production difficulties can not be ignored

    Multi-layer PCBs are used as the "core main force" in the fields of communications, medical treatment, industrial control, security, automobiles, electric power, aviation, military industry, and computer peripherals. Product functions are getting higher and higher, and PCBs are getting more and more sophisticated, so relative to the difficulty of production Also getting bigger.

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