BCM82790BIFSBG Manufacturers

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BCM82790BIFSBG, Based on our automatic production line, steady material purchase channel and quick subcontract systems have been built in mainland China to meet customer's wider and higher requirement in recent years. We have been looking forward to cooperating with more clients worldwide for common development and mutual benefit!Your trust and approval are the best reward for our efforts. Keeping honest, innovative and efficient, we sincerely expect that we can be business partners to create our brilliant future!

Hot Products

  • AD250 PCB

    AD250 PCB

    High-frequency mixed-press material step board manufacturing technology is a circuit board manufacturing technology that has emerged with the rapid development of the communications and telecommunications industries. It is mainly used to break through the high-speed data and high information content that traditional printed circuit boards cannot reach. The bottleneck of transmission. The following is about AD250 PCB related, I hope to help you better understand AD250 PCB.
  • 4-Layer Rigid-Flex PCB

    4-Layer Rigid-Flex PCB

    4-Layer Rigid-Flex PCB In terms of equipment, due to the difference in material characteristics and product specifications, the equipment in the lamination and copper plating parts must be corrected. The applicability of the equipment will affect the yield and stability of the product, so it will enter the Rigid-Flex Before the production of the board, the suitability of the equipment must be considered. The following is about 4 Layer Rigid Flex PCB related, I hope to help you better understand 4 Layer Rigid Flex PCB.
  • XCF02SVO20C

    XCF02SVO20C

    XCF02SVO20C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU11P-3FLGC2104E

    XCVU11P-3FLGC2104E

    ​XCVU11P-3FLGC2104E is an FPGA (Field Programmable Gate Array) chip launched by Xilinx, belonging to the Virtex UltraScale+series. This chip has been widely used in fields such as data centers, network communication, video and image processing due to its high performance, low power consumption, and flexibility.
  • 5CEBA4U15I7N

    5CEBA4U15I7N

    ​5CEBA4U15I7N is an FPGA (Field Programmable Gate Array) chip produced by Intel (formerly Altera Corporation), belonging to the Cyclone V E series. This chip has the following key features
  • 5AGTMC3D3F31I3G

    5AGTMC3D3F31I3G

    5AGTMC3D3F31I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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