BCM67263B0KFFBG Manufacturers

The shopper satisfaction is our primary focus on. We uphold a consistent level of professionalism, quality, credibility and repair for BCM67263B0KFFBG, With the advancement of society and economy, our enterprise will continue to keep a tenet of "Focus on trust, high quality the first", moreover, we expect to produce a wonderful future with each customer.
BCM67263B0KFFBG, Customer's satisfaction is always our quest, creating value for customers is always our duty, a long term mutual-beneficial business relationship is what we've been doing for. We are an absolutely reliable partner for yourself in China. Of course, other services, like consulting, can be offered too.

Hot Products

  • Ro3003 Material

    Ro3003 Material

    Ro3003 Material is a high frequency circuit material filled with PTFE composite material, which is used in commercial microwave and RF applications. The product series aims to provide excellent electrical and mechanical stability at competitive prices. Rogers ro3003 has excellent dielectric constant stability over the entire temperature range, including eliminating the change of dielectric constant when using PTFE glass at room temperature. In addition, the loss coefficient of the ro3003 laminate is as low as 0.0013 to 10 GHz.
  • 5CGXFC9E6F35C7N

    5CGXFC9E6F35C7N

    ​5CGXFC9E6F35C7N is an FPGA chip belonging to the Cyclone V GX series produced by Intel (formerly known as Altera). This chip has the following characteristics and parameters:
  • XC3S500E-4FGG320C

    XC3S500E-4FGG320C

    XC3S500E-4FGG320C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7K70T-3FBG676E

    XC7K70T-3FBG676E

    XC7K70T-3FBG676E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM84544WA1IFSBG

    BCM84544WA1IFSBG

    BCM84544WA1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX16-2FTG256I

    XC6SLX16-2FTG256I

    XC6SLX16-2FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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