BCM65040IMLGT Manufacturers

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BCM65040IMLGT, Our company mission is that providing high quality and beautiful solutions with reasonable price and strive to gain 100% good reputation from our clients. We believe Profession achieves excellence! We welcome you to cooperate with us and grow up together.

Hot Products

  • EP4CE10F17I7N

    EP4CE10F17I7N

    ​The EP4CE10F17I7N Cyclone IV E equipment provides speed levels of -6, -7, -8, -8L, and -9L for commercial equipment, -8L for industrial equipment, and -7 for expanding industrial and automotive equipment
  • XC5VSX95T-2FFG1136C

    XC5VSX95T-2FFG1136C

    XC5VSX95T-2FFG1136C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10CL120YF484I7G

    10CL120YF484I7G

    10CL120YF484I7G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications. 10CL120YF484I7G is commonly used in applications such as industrial automation, gaming, and low-power embedded systems. The device is known for its low power consumption, low cost, and high processing capacity, making it an excellent choice for applications where cost and power consumption are critical factors.
  • XC9572XL-7VQG64I

    XC9572XL-7VQG64I

    XC9572XL-7VQG64I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CEFA9F23I7N

    5CEFA9F23I7N

    5CEFA9F23I7N adopts the FBGA-484 packaging method. This packaging has good heat dissipation performance and reliability, and can effectively protect the internal circuit of the chip.
  • BCM88682CA1KFSBG

    BCM88682CA1KFSBG

    ​BCM88682CA1KFSBG is an electronic component designed and produced by Broadcom brand, with the following characteristics:

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