BCM56860A1KFSBG Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XCKU035-2FBVA676E

    XCKU035-2FBVA676E

    XCKU035-2FBVA676E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5AGTMD3G3F31I3G

    5AGTMD3G3F31I3G

    5AGTMD3G3F31I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCZU2CG-1SFVC784I

    XCZU2CG-1SFVC784I

    XCZU2CG-1SFVC784I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX45T-3CSG484C

    XC6SLX45T-3CSG484C

    XC6SLX45T-3CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Ro4835LoPro PCB

    Ro4835LoPro PCB

    Ro4835LoPro PCB--For the processing of high cost performance SIW circuits, another advantage of using ro4835blopro and ro4835lopro materials is that the processing cost can be reduced through the standard FR-4 epoxy / glass process.
  • Teflon PCB

    Teflon PCB

    Teflon PCB (also called PTFE board, Teflon board, Teflon board) is divided into two kinds of molding and turning. The molding board is made of PTFE resin at room temperature by molding, and then sintered, Made by cooling. The PTFE turning plate is made of PTFE resin through compacting, sintering and rotary cutting.

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