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BCM56648KB0KFSBLG Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    XC6SLX4-2CPG196C

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    XC7K325T-2FFG900C

    ​XC7K325T-2FFG900C is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.
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    XC3S1200E-4FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • VIA in PAD PCB

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    The via-in-PAD is an important part of the multilayer PCB. It not only bears the performance of the main functions of the PCB, but also uses the via-in-PAD to save space.The following is about VIA in PAD PCB related, I hope to help you better understand VIA in PAD PCB.
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    Multi-layer PCB is a circuit board composed of more than two layers of electrical layer (copper foil layer) superimposed on each other. The copper layers are bonded together by layers of resin.

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