BCM56265B0KFSBG Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XC3S50A-4TQG144C

    XC3S50A-4TQG144C

    XC3S50A-4TQG144C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC5VLX50T-2FFG665C

    XC5VLX50T-2FFG665C

    XC5VLX50T-2FFG665C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7K410T-2FFG900C

    XC7K410T-2FFG900C

    XC7K410T-2FFG900C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU5P-1FLVB2104I

    XCVU5P-1FLVB2104I

    ​XCVU5P-1FLVB2104I is an FPGA chip produced by Xilinx, belonging to the UltraScale+series. This chip integrates up to 1.5 million system logic units and utilizes second-generation 3D integrated circuit technology to integrate multiple PCI Express Gen3 cores, improving system performance
  • FPC Flexible Circuit Board

    FPC Flexible Circuit Board

    FPC Flexible Circuit Board,Flexible Printed Circuit, or FPC for short, is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the substrate. It has the characteristics of high wiring density, light weight, thin thickness and good bendability.
  • XCKU095-1FFVB1760C

    XCKU095-1FFVB1760C

    ​The XCKU095-1FFVB1760C has the highest signal processing bandwidth among mid-range next-generation transceivers and can be used for packet processing in 100G networks and data center applications.

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