BCM5248UA4IQLEG Manufacturers

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Hot Products

  • 5SGXMA4H2F35I3LG

    5SGXMA4H2F35I3LG

    5SGXMA4H2F35I3LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7S50-1FGGA484I

    XC7S50-1FGGA484I

    XC7S50-1FGGA484I is a type of FPGA (Field Programmable Gate Array) made by Xilinx. This specific FPGA has 52,160 Logic Cells, operates at a speed of up to 300 MHz, and features 2.1 Mb of Block RAM, 100 DSP Slices, and 46 user I/Os.
  • MT41K128M16JT-107:K

    MT41K128M16JT-107:K

    MT41K128M16JT-107:K is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10G optical module PCB

    10G optical module PCB

    In the era of rapid development of interconnected data and optical networks, 100G optical modules PCB , 200G optical modules PCB and even 400G optical modules PCB are constantly emerging. However, high speed has the advantages of high speed, and low speed also has the advantages of low speed. In the era of high-speed optical modules, 10G optical module PCB support the operations of manufacturers and users with their unique advantages and relatively low cost.10G optical module, as the name suggests, is an optical module that transmits 10G of data per second.According to inquiries: 10G optical modules are packaged in 300pin, XENPAK, X2, XFP, SFP+, and other packaging methods.
  • EP4SGX110HF35C3G

    EP4SGX110HF35C3G

    EP4SGX110HF35C3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 10 layers of HDI PCB

    10 layers of HDI PCB

    HDI board (High Density Interconnector), that is, high-density interconnection board, is a circuit board with a relatively high line distribution density using micro-blind and buried via technology.The following is about 10 layers of HDI PCB, I hope to help you better understand 10 layers of HDI PCB.

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