ADUM4223BRWZ Manufacturers

We emphasize improvement and introduce new goods into the market each year for ADUM4223BRWZ, Honesty is our principle, expert operation is our perform, support is our goal, and customers' fulfillment is our future!
ADUM4223BRWZ, Now we have constructed strong and long co-operation relationship with an enormous quantity of companies within this business overseas. Immediate and professional after-sale service supplied by our consultant group has happy our buyers. In depth Info and parameters from the merchandise will probably be sent to you for any thorough acknowledge. Free samples may be delivered and company check out to our corporation. n Portugal for negotiation is constantly welcome. Hope to get inquiries type you and construct a long-term co-operation partnership.

Hot Products

  • ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB is the interconnection hole technology in any layer. This technology is the patent process of Matsushita Electric Component in Japan. It is made of short fiber paper of DuPont's "poly aramid" product thermount, which is impregnated with high-function epoxy resin and film. Then it is made of laser hole forming and copper paste, and copper sheet and wire are pressed on both sides to form a conductive and interconnected double-sided plate. Because there is no electroplated copper layer in this technology, the conductor is only made of copper foil, and the thickness of the conductor is the same, which is conducive to the formation of finer wires.
  • 24G High frequency PCB

    24G High frequency PCB

    24G High frequency PCB--24GHz microstrip array antenna, select 10mil or 20mil thickness for small array, 20mil thickness for large array, and 10mil thickness for RF board.The following is about 24G High frequency PCB, I hope to help you better understand 24G High frequency PCB.
  • Robot 3step HDI PCB

    Robot 3step HDI PCB

    The heat resistance of the Robot 3step HDI PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.
  • EPF10K50RI240-4N

    EPF10K50RI240-4N

    EPF10K50RI240-4N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CEBA9F23C7N

    5CEBA9F23C7N

    ​5CEBA9F23C7N is a Cyclone V series FPGA chip produced by Intel (formerly Altera). This chip has high performance and flexibility, suitable for various complex design requirements. Its main features include:
  • LTM4613IY#PBF

    LTM4613IY#PBF

    LTM4613IY#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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