TU-862S PCB Manufacturers

5AGTMD3G3F31I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

XC6SLX45-L1CSG324I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

18 layers copper paste plug hole PCB realizes high-density assembly of printed circuit boards and non-conductive copper paste for via plug holes of wiring. It is widely used in aviation satellites, servers, wiring machines, LED backlights, etc.The following is about 18 layers copper paste plug hole, I hope to help you better understand 18 layers copper paste plug hole.

XCKU15P-2FFVE1517I is an FPGA (Field Programmable Gate Array) chip from Xilinx, which belongs to the Kintex UltraScale+ family. The chip utilizes 20nm process technology and features 1.4 million logic cells and 5,520 DSP slices.

BCM59101BKMLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

XC7A35T-2CPG236C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.